Ing. Jan Novák, Ph.D.

The paper solves the model of the miniature Power supply based on the piezoelectric cantilever. The aim of the future is to further hybrid integration and use of nanotechnology. Contents of the article belongs to the category of renewable energy sources with environment energy conversion into electrical energy. The work is focused on the use in small temperature differences.

The work is focused on the analysis of the thermoelectric generator based on the thermoelectrical effect. The aim idea of the future is to further hybrid integration with semiconductor structures, event. used of nanotechnology. The work is focused on the use of heat of thermally stressed semiconductor structures with subsequent generation of electrical energy, such as GaN semiconductors designed for the automotive industry. The analysis is performed for 4 types of thermoelectric generators (TEG), obtaining energy and storing it in a supercapacitor. The aim was to verify the possibility of using thermoelectric effect, verifying properties using model, determine the essential characteristics, finding the optimum load, output voltage and output power achieved. The operation control of the thermoelectric generator was realized with the circuit LTC3108. We used thermoelectric batteries as a heat energy converter (TEC1- 12707, TEC1-071080, TEG-127020 a TEG-127009).

A large number of IoT nodes creates a danger of extra expenditures when changing the battery. For this reason, the development of supply nodes tends to prefer systems capable of battery-less operation, obtaining energy from other sources. This article deals with an alternative method of electrical energy acquisition form the excessive heat appearing in LED lighting fixtures utilizing large-area LED chips. A Peltier cell was used for the conversion of heat energy to electrical energy, connected as thermo-electric generator into the thermal chain.

This paper demonstrates the concept of node consumption reduction for IoT applications. The main emphasis is placed on the autonomy of the whole device, which must be independent of external power supply. That is why energy harvesting based on temperature principle is used for power supply. One of the parameters monitored is the service uptime. The concept of intelligent control of the individual parts of the equipment leads to significant energy savings. This control requires the use of low power components, but only their appropriate connection and mutual monitoring of their operating modes leads to the desired savings. This algorithm can be adapted to the needs of IoT nodes focused on real-time performance applications or the process tracking slow low power applications. This concept will ultimately be adapted to a wireless node for monitoring position and temperature for use in medical applications to monitor the patient's position on the bed or position while moving.

The development of IoT instrumentation will always be strongly influenced by the properties of the power supply system. A large number of IoT nodes creates a danger of extra expenditures when changing the battery. For this reason, the development of supply nodes tends to prefer systems capable of battery-less operation, obtaining energy from other sources. This article deals with an alternative method of electrical energy acquisition form the excessive heat appearing in LED lighting fixtures utilizing large-area LED chips. A Peltier cell was used for the conversion of heat energy to electrical energy, connected as thermo-electric generator into the thermal chain.

This paper discusses the concept, design and testing of a IoT based monitoring system for the needs of farmers. The system consists of integrated autonomous BLE beacons, which are located on the monitored objects (in our model case it is cattle). These beacons transmit their identification data in specified periods together with other additional information, which then serves to perform accurate targeting of the monitored object in the monitored area (meadow, fence). This data is periodically received by a central hub, which brings this information together, eliminates duplications and sends the final datagram containing information about active beacons via the GSM network (or LoRa) to a central server, where the data is subsequently processed. A pilot test experiment is taking place this summer on a private farm in Central Bohemia.

Článek se zabývá návrhem a testováním monitorovacího systému pro potřeby farmářů. Systém sestává z integrovaných autonomních BLE beacon, které jsou umístěny na sledovaných objektech (v našem modelovém případě se jedná o skot). Tyto beacony vysílají v určených periodách svoje identifikační údaje společně s dalšími doplňkovými informacemi, které následně slouží pro provedení přesného zaměření sledovaného objektu ve sledovaném prostoru (louka, pastva, ohradník). This paper discusses the concept, design and testing monitoring system for the needs of farmers. The system consists of integrated autonomous BLE beacons, which are located on monitored objects (in our model case, cattle). These beacons transmit their identification data in specified periods together with other additional information, which is then used to perform the precise targeting of the monitored object in the monitored area (meadow, grazing, fence).

This paper discusses the concept, design and testing monitoring system for the needs of farmers. The system consists of integrated autonomous BLE beacons, which are located on monitored objects (in our model case, cattle). These beacons transmit their identification data in specified periods together with other additional information, which is then used to perform the precise targeting of the monitored object in the monitored area (meadow, grazing, fence).

The core of the article solves the microsystem model of the electric generator based on the piezoelectric effect. The aim of the future is to further hybrid integration and use of nanotechnology. Contents of the article belongs to the category of renewable energy sources with environment energy conversion into electrical energy. The aim was to verify the possibility of using piezoelectric effect, verifying properties using model, determine the essential characteristics, finding the optimum load, output voltage and output power achieved. Attention is given to the basic principles of activities, electronic circuit connection as well as behaviour of the piezoelectric cantilever.

The advent of novel sub-micron technologies of IC fabrication led to such a decrease in lead-to-lead separation that it is not possible any more to neglect the influence of these leads on the reliability of the system operation. Both the small lead separation and the application of multilayer interconnecting systems cause parasitic electromagnetic couplings; in the case of a unipolar CMOS technology, the capacitive coupling is the dominant effect. It is impossible to measure direct the rapid variations voltage between leads inside the IC.

The electromagnetic couplings cause a transfer of interfering energy from the interference source (transmitter) to the interference receiver. Parasitic couplings may be created by designs that are unsuitable in respect of the EMC

The connection system is the principal source of parasitic electromagnetic couplings within integrated circuit structures. In order to solve these electromagnetic couplings, it is necessary to define the distribution of electromagnetic fields in the connection system of each particular integrated circuit. The analytical approach to the solution of electromagnetic fields in connection systems is only suitable for the elementary form of homogeneous lines, however. When solving real situations of connecting systems in integrated circuits, numerical solution of electromagnetic fields must be applied, since only this approach permits to accurately express the local properties of connection systems in terms of electromagnetic field distribution calculations.

For optimum efficiency of digital systems composed of electronic components it is required that the changes of states of the active devices are performed as quickly as possible. The rapid variations of voltage and the resulting rapid variations of current create time-variable electric and magnetic fields around the devices and, even more important, around the connecting electric leads. These fields can cause operation faults in the digital system itself as well as in electronic systems located in close vicinity, sometimes even at larger distances. The article shows how to use the exact solution of numerical modeling of the physical fields, as well as the analogy of electric and magnetic fields.

The main target of the paper was the solution of electromagnetic compatibility in integrated circuits and microsystems. The electromagnetic compatibility serves as a measure for the possibility of co-existence of numerous electronic systems occupying a common environment without unwanted electromagnetic couplings that could interfere with correct functioning of individual systems. Unwanted electromagnetic couplings do appear between leads inside the integrated circuit. During the process of signal propagation along the leads, parasitic electromagnetic couplings can cause interference in other signal leads. Such as interference can result in random disturbances in the integrated circuit.

t is impossible to measure direct the rapid variations voltage between leads inside the IC. The measuring integrated circuit contains additionally flash A/D converter. This one converts voltage of measured leads to a digital form. Digital data can be analyzed outside the IC without waveform distortions.

Accurate point contact thermometer for measurements from -200 to 200 Centigrade applicable in engineering and biology, resolution 1 mK, accuracy 10 mK.

The capacitive coupling is the predominant type of coupling in high-impedance circuits, like NMOS and CMOS IC's. The way of transforming the capacitive coupling between conductors inside an IC to ideal capacitors.

Wide range tunable LC Oscillator with electronically stabilized amplitude

The accurate calculation of parasitic coupling of the signal interconnections helps us to design detailed circuit models of the interconnecting systems. Critical spots in an electronic system, where parasitic couplings cause failures, can be found by simulation of the circuit models.

Photoresistor device provides linear regulation of negative feedback to an op amp producing linear response

The shielded conductor systems can be divided to systems using direct electric field shielding and system using indirect shielding. The systems utilizing direct shielding put an additional conductor, connected to common ground, in the same plane, between the interfering and the interfered conductor.

Inductive Couplings inside of the Integrated Circuits are a main topic of this paper

This paper describes analysis and measurement of capacitive coupling in integrated circuits

This paper describes analysis of capacitive coupling in CMOS integrated circuits

This paper describes the non-zero Sensor Aperture Effects in signal Acquisition and Processing

The development of integrated circuits has reached a situation today that the circuit operating speed is not limited by the parameters of the transistors any more, but rather by the electrical parameters of the interconnections inside the integrated circuit. For this reason, it is necessary to take in account the properties of interconnecting conductors from the start of the circuit design process. Undesirable parasitic electromagnetic couplings appear between the interconnecting lines, causing the transfer of interfering impulses onto the signal-carrying lines. These interfering impulses then result in random errors and/or disturbances in the integrated circuit.

The development of integrated circuits has reached a situation today that the circuit operating speed is not limited by the parameters of the transistors any more, but rather by the electrical parameters of the interconnections inside the integrated circuit. For this reason, it is necessary to take in account the properties of interconnecting conductors from the start of the circuit design process. Undesirable parasitic electromagnetic couplings appear between the interconnecting lines, causing the transfer of interfering impulses onto the signal-carrying lines. These interfering impulses then result in random errors and/or disturbances in the integrated circuit. In order to be able to solve the problem of electromagnetic couplings inside integrated circuits, it is imperative to be able to determine the electrical parameters of the interconnecting girds as accurately as possible.

The development of integrated circuits has reached a situation today that the circuit operating speed is not limited by the parameters of the transistors any more, but rather by the electrical parameters of the interconnections inside the integrated circuit. For this reason, it is necessary to take in account the properties of interconnecting conductors from the start of the circuit design process. Undesirable parasitic electromagnetic couplings appear between the interconnecting lines, causing the transfer of interfering impulses onto the signal-carrying lines. These interfering impulses then result in random errors and/or disturbances in the integrated circuit. In order to be able to solve the problem of electromagnetic couplings inside integrated circuits, it is imperative to be able to determine the electrical parameters of the interconnecting girds as accurately as possible.

The electromagnetic compatibility (EMC) is one of the most important reliability parameters of electronic systems and devices. When EMC effects are properly taken care of during the design, the additional work and expense will return handsomely in a better reliability and competitiveness of the final product. Integrated circuits in high level integration technologies require multilayer connecting lead systems employing high lead density and resulting in diminishing distances between individual leads. The small distances result in increased signal crosstalk inside the integrated circuit. By applying a method of crosstalk prediction in digital circuits using simple passive LCR circuit models.

The electromagnetic compatibility serves as a measure for the possibility of co-existence of numerous electronic systems occupying a common environment without unwanted electromagnetic couplings that could interfere with correct functioning of individual systems. The microsystems, for example cardiac pacemaker, can be assumed to be independent electronic systems set up of individual operational blocks. The conveying of signals between blocks is provided by networks of electrical leads. Unwanted electromagnetic couplings do appear between leads inside the integrated circuit. During the process of signal propagation along the leads, parasitic electromagnetic couplings can cause interference in other signal leads. Such as interference can result in random disturbances in the microsystem. So, in solving the electromagnetic compatibility in microsystems, a considerable stress must be given to correct determination of parasitic electromagnetic couplings in the connecting lead systems.

For optimum efficiency of digital systems in ICs composed of gates it is required that the changes of states of the active devices are performed as quickly as possible. The rapid variations of voltage and the resulting rapid variations of current create time-variable electric and magnetic fields around the devices and, even more important, around the connecting electric leads. Digital integrated circuits in high level integration technologies require multilayer connecting lead systems employing high lead density and resulting in diminishing distances between individual leads. The small distances result in increased signal crosstalk inside the integrated circuit.

A. C. Analysis of Parasitic Couplings in Digital Integrated Circuits

Frequency characteristic of the capacitave coupling in CMOS integrated circuits

Integrated Pressure Sensor - Use of Microsystems Model Flow

Intelligent Sensor Structure for Tilt Measure

Macromodel of Intelligent Sensor Structure with Accelerometer

Macromodel of Intelligent Sensor Structure with Accelerometer

Microsystem Models in Integrated Pressure Sensor Design

Microsystem Models in Integrated Pressure Sensor Design

The Design of Anemometric Sensor System for Measurement of Wind Velocity and Direction with Integrated Measure Probe

This paper describes the Design of Anemometric Sensor System for Measurement of Wind Velocity and Direction with Integrated Measure Probe

EMC problem in the integrated circuits.

EMC problem in the integrated circuits.

EMC problem in the integrated circuits

EMC problems in the integrated circuits

EMI problems in the integrated circuits

Parasitic Electromagnetic Coupling in PC Boards

EMC issues

Spinaci sum CMOS obvodu