FMP Group – Functional Materials Printing Group

The FMP Group at the Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, focuses on the research and development of advanced functional materials for additive manufacturing, with particular emphasis on printed electronics and sensors. The group’s work spans the entire chain, from the design and preparation of composite materials for FDM, SLA and DIW technologies, through their materials characterisation, to the development of specific applications. In this way, the group bridges basic and applied research, which it also pursues within national research projects.

Current research directions

  • Polymer–ceramic composite materials for dielectric and piezoelectric applications – development of filaments for FDM and photocurable resins for SLA
  • Printed electronics and sensors
  • Advanced polymer–metal structures – metallisation of 3D-printed parts for mechanical engineering applications
  • Environmental sustainability – replacing conventional materials and technologies, e.g. in printed circuit board manufacturing
  • 3D-printed components for high-voltage engineering

The group collaborates with other research teams across the Department of Electrotechnology, the Faculty of Electrical Engineering and CTU as a whole, as well as with external partners through contract research and funded projects. Students can get involved through bachelor’s, master’s and doctoral theses. Research results are regularly published in leading peer-reviewed journals such as Virtual and Physical Prototyping, Ceramics International and Advanced Sustainable Systems.

The group operates the 3D Printing Facility. The facility is equipped with a 3D printing farm of FDM and SLA printers in various configurations, including multi-material printing, and with DIW printers for printed electronics and rapid PCB prototyping. It also has a laboratory twin-screw extruder with two gravimetric feeders for producing thermoplastic printing filament, used primarily for composite materials (polymers with powder fillers).

Responsible person Ing. Mgr. Radovan Suk