Ing. Pavel Tichý, MBA

A Ball Grid Array (BGA) component has become one of the most popular packaging alternatives for high density integrated electronics devices. BGA packages become smaller and electrical equipment has become lighter, therefore such equipment is more sensitive to mechanical stress. Therefore the underfill of the chips is used to improve the lifetime and reliability of electronic equipment. On the other hand there are issues with removing of the underfilled component from the printed circuit board (PCB) without damaging the PCB together with soldering pads. The goal of this article is to present the rework possibility of underfilled components, when a very fine milling machine was developed for the components rework purposes in LVR at CTU in Prague.

Článek popisuje návrh a tvorbu a realizaci 3D tisku pro účely projektu HeRo