Lidé

doc. Ing. Pavel Mach, CSc.

Všechny publikace

Effect of Temperature Shocks on the Resistance of Joints Formed of Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. David Bušek, Ph.D., Sokol, J.
  • Publikace: 2023 46th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2023. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 979-8-3503-3485-2.
  • Rok: 2023
  • DOI: 10.1109/ISSE57496.2023.10168314
  • Odkaz: https://doi.org/10.1109/ISSE57496.2023.10168314
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Conductive adhesive joints were climatically aged with temperature pulses in the range of -40 to 115 oC. The joints were made of two types of electrically conductive adhesives. The joints were first exposed for 15 minutes in the hot chamber of the thermal pulse testing device, then moved within 8 seconds to the cold chamber and exposed again for 15 minutes. This cycle was repeated two hundred times and five hundred times. The connection resistance was measured using the four-point method. Exposure to temperature pulses was found to cause small changes only in junction resistance.

Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. David Bušek, Ph.D., Sokol, J.
  • Publikace: 2023 46th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2023. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 979-8-3503-3485-2.
  • Rok: 2023
  • DOI: 10.1109/ISSE57496.2023.10168360
  • Odkaz: https://doi.org/10.1109/ISSE57496.2023.10168360
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The temperature dependence of the resistance of adhesive conductive joints and the thermal coefficient of longitudinal expansion of conductive adhesives were examined. . The adhesive was applied by stencil printing. The resistance of the joints was measured by the four-point method and the thermal expansion of used adhesives was measured by the thermomechanical analysis technique. The junction resistance was found to increase approximately linearly with temperature. . It was also found that the coefficient of thermal longitudinal expansion varies depending on the adhesive and also on the sample when all samples are made from the same adhesive.

Influence of Current Pulses on Resistance of Conductive Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Svoboda, M.
  • Publikace: 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika). Institute of Electrical and Electronics Engineers, Inc., 2022. p. 169-174. ISBN 978-1-6654-8082-6.
  • Rok: 2022
  • DOI: 10.1109/Diagnostika55131.2022.9905172
  • Odkaz: https://doi.org/10.1109/Diagnostika55131.2022.9905172
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Adhesive conductive joints were formed from two types of electrically conductive adhesives with isotropic electrical conductivity and loaded first climatically, and then by current pulses. Climatic loading was carried out for one group of joints at normal temperature and 99 % relative humidity and for the other group at a temperature of 85 oC and relative humidity of 85 %. The exposure time was always 300 hours. Then the joints were loaded with current pulses with a frequency of 50 Hz for 20, 50, and 100 minutes. The amplitudes of the current pulses were 5, 15, and 40 A, respectively. Climatic loading caused only small changes in the resistance of the joints. The same applies to current pulse loading.

Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Závora, F.
  • Publikace: 2022 45th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2022. p. 1-6. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2536. ISBN 978-1-6654-6589-2.
  • Rok: 2022
  • DOI: 10.1109/ISSE54558.2022.9812817
  • Odkaz: https://doi.org/10.1109/ISSE54558.2022.9812817
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    In this work, the resistance of joints formed by two types of conductive adhesives with isotropic electrical conductivity on pads with copper and gold surface finish is monitored. The joints are climatically loaded by heat shocks and exposure to elevated temperature and humidity. The method of factor experiments and Taguchi's orthogonal arrays are used to determine which of these climatic factors has a more significant effect on the change in joint resistance. It was found that the dominant aging factor differs for different adhesives and that the results obtained by both methods are close in cases where the effect of factor interactions on the joint resistance is small.

Analysis of a failure in a molded package caused by electrochemical migration

  • DOI: 10.1016/j.engfailanal.2020.105128
  • Odkaz: https://doi.org/10.1016/j.engfailanal.2020.105128
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical components can fail during their function in an electrical circuit, especially in a harsh environment. One of the possible failure reasons is the electrochemical migration, which leads to a short circuit or change of electrical parameters of components. This paper focuses on electrochemical effects and explains mechanisms leading to the formation of a conductive path within a component molded in a plastic package. Appropriate diagnostic methods SEM/EDS and penetration tests have been chosen in order to find the root cause for short circuit creation. It was found that the conductive path appeared due to electrochemical migration of silver between the Electrically Conductive Adhesive (ECA) joints connecting the capacitor package. A tiny gap that was found between the molding compound and the leadframe of the package, showed to be the necessary condition for the electrochemical migration to appear. The main aim of this work was not just to identify the cause of an inadvertent conductive path creation, but also to identify the part of the manufacturing process, where similar problems can be prevented.

Climatic Aging of Conductive Adhesive Joints on Pads with Different Surface Finishes

  • Autoři: doc. Ing. Pavel Mach, CSc., Lacina, R.
  • Publikace: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME). New York: IEEE Press, 2021. p. 156-159. ISBN 978-1-6654-2110-2.
  • Rok: 2021
  • DOI: 10.1109/SIITME53254.2021.9663676
  • Odkaz: https://doi.org/10.1109/SIITME53254.2021.9663676
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Adhesive joints formed from four types of electrically conductive adhesives based on an insulating matrix from the bis-phenol epoxy matrix and silver filler have been aged at the combined temperature-humidity climate. Four combinations of these parameters have been used for climatic treatment: 25 °C and 50 % or 85 % RH, 85 °C and 50 % or 85 % RH. The total time of aging is 400 hours. It has been found that the combination of increased temperature and increased humidity causes the fastest increase of joint resistance.

Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging

  • Autoři: doc. Ing. Pavel Mach, CSc., Lacina, R.
  • Publikace: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME). New York: IEEE Press, 2021. p. 160-164. ISBN 978-1-6654-2110-2.
  • Rok: 2021
  • DOI: 10.1109/SIITME53254.2021.9663585
  • Odkaz: https://doi.org/10.1109/SIITME53254.2021.9663585
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The article is focused on the calculation of mathematical models for the calculation of the resistance of adhesive joints from adhesives of four manufacturers made on pads with Cu and Ag surface finish. Aging is performed in a combined climate of elevated humidity / elevated temperature. Factor experiment technique was used to calculate the models. The created models showed good agreement with the measured data.

Noise Diagnostics of Climatically Treated Joints Formed from Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Lacina, R.
  • Publikace: 2021 44th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2021. p. 1-4. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7.
  • Rok: 2021
  • DOI: 10.1109/ISSE51996.2021.9467510
  • Odkaz: https://doi.org/10.1109/ISSE51996.2021.9467510
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The noise measurement was used for monitoring the changes of the joints made from electrically conductive adhesive caused by mechanical and climatic treatment. A total of five types of isotropic adhesives were tested. %. Joints loaded with the mechanical stress and joints without this load were aged at the temperature of 120 oC and the RH 64 % for 1000 hours. It was found that the mechanical load accelerates the changes caused by climatic treatment.

Study of Changes in the Dissipation Factor of PP Film Capacitors Caused by Heat Treatment

  • Autoři: doc. Ing. Pavel Mach, CSc., Horák, M.
  • Publikace: 2021 44th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2021. p. 1-5. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7.
  • Rok: 2021
  • DOI: 10.1109/ISSE51996.2021.9467566
  • Odkaz: https://doi.org/10.1109/ISSE51996.2021.9467566
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The coefficient of variation of the dissipation factor of PP (polypropylene) film capacitors was examined in dependence on the time of heat treatment and the frequency. Five groups of PP film capacitors from five manufacturers were taken under test. Every group was composed of twenty capacitors. The nominal capacitance of the capacitors was 0.1 microF and the maximum operating voltage 275 V AC. The heat treatment was carried out at the temperature of 100 oC for a total time 22 983 hours. It was found that the inspection of the variation coefficient can be good additional information to the monitoring the loss factor.

Analysis of Changes Due to Long-Term Thermal Aging in Capacitors Manufactured from Polypropylene Film

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. Martin Horák, Ph.D.,
  • Publikace: 2020 43rd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2020. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2536. ISBN 978-1-7281-6773-2.
  • Rok: 2020
  • DOI: 10.1109/ISSE49702.2020.9121021
  • Odkaz: https://doi.org/10.1109/ISSE49702.2020.9121021
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    It has been found that the long-term thermal aging at the temperature of 100 oC and relative humidity 54 %, causes a low change of the capacitance and a high change of the loss factor of polypropylene (PP) film capacitors. The goal of the work has been to find main reasons of these changes. Dismounting of aged capacitors has shown that the metal layers on the PP film, which form the capacitor electrodes, near the metal contacts on the ends of the body of the capacitor are strongly corroded and sometimes even totally absent. On the other hand, the change of the total electrodes area is not significant, because the capacitance decreases only slightly during the thermal aging. A significant increase in the loss factor must be the increase the resistance of the metal layers that form the capacitor electrodes.

Analysis of Influence of Factors Affecting Electrical Resistance of Joints Formed from Conductive Adhesive

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. Martin Horák, Ph.D.,
  • Publikace: 2020 43rd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2020. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-7281-6774-9.
  • Rok: 2020
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    For effective use of conductive adhesives in a variety of conditions, it is necessary to know how strong the influence on the resistance of the adhesive joint has factors associated with these conditions. The experiments have been carried out with 6 types of conductive adhesives. the effect of curing, humidity, the influence of DC current, and modifying the adhesive with nanoparticles was tested. Theoretical analysis has been carried out using full factorial experiments and Taguchi orthogonal arrays.

Dependence of Shear Strength of Adhesive Conductive Joints on Adhesive Modification with the Silver Nanoparticles and Climatic Aging

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Published in: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). Pitesti: University of Pitesti, 2020. p. 331-334. ISBN 978-1-7281-7506-5.
  • Rok: 2020
  • DOI: 10.1109/SIITME50350.2020.9292188
  • Odkaz: https://doi.org/10.1109/SIITME50350.2020.9292188
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The dependence of the shear strength of adhesive joints formed from electrically conductive adhesive was inspected. All adhesives had isotropic electrical conductivity and were based on an epoxy matrix filled with silver flakes. The adhesives were modified with silver nanoparticles. The aging of the joints at the high temperature was also carried out. It was found different dependence of the shear strength for joint made from adhesives of different manufacturers.

Effect of Time of Loading, Frequency, and Amplitude of Current Pulses on Nonlinearity of I–V Characteristic of Conductive Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2020 International Conference on Diagnostics in Electrical Engineering (Diagnostika). Institute of Electrical and Electronics Engineers, Inc., 2020. p. 193-197. ISBN 978-1-7281-5879-2.
  • Rok: 2020
  • DOI: 10.1109/Diagnostika49114.2020.9214754
  • Odkaz: https://doi.org/10.1109/Diagnostika49114.2020.9214754
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Adhesive joints from electrically conductive adhesives were prepared by adhesive assembly resistors 0R0 on test PCBs. Two types of adhesives were used for the adhesive assembly. Adhesives were applied by stencil printing. The joints were loaded with the current pulses. The dependence of the nonlinearity of the current-voltage characteristics was inspected. It was found that for two-component adhesive the dominant influence had the time of loading, for one-component the amplitude of the pulses.

Electrically Conductive Adhesives in Electronics

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The article in the first part describes the basic properties of electrically conductive adhesives and their basic applications. The second part is focused on the examination of the resistance of adhesive joints made of isotropic conductive adhesives for different types of loading. It has been found that the maximum changes of the joint resistances are caused with combined humidity-heat treatment.

Nonlinearity of Current-voltage Characteristic of PP Film Capacitors During Long-term Thermal Treatment

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2020 International Conference on Diagnostics in Electrical Engineering (Diagnostika). Institute of Electrical and Electronics Engineers, Inc., 2020. p. 185-189. ISBN 978-1-7281-5879-2.
  • Rok: 2020
  • DOI: 10.1109/Diagnostika49114.2020.9214601
  • Odkaz: https://doi.org/10.1109/Diagnostika49114.2020.9214601
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The nonlinearity of current-voltage characteristics of PP film capacitors was examined during their long-term exposition at the temperature of 100 °C and relative humidity of 54 %. The total time of thermal aging was 19,939 hours and was divided into 11 stages. The measurement of nonlinearity was carried out before the thermal treatment and at the end of every stage. Changes of nonlinearity were continuous without any extremes, indicating a progressive degradation of capacitors.

Thermal Lifetime Calculation of Capacitor Insulation Using the Activation Energy Method

  • DOI: 10.1109/TCPMT.2020.3019275
  • Odkaz: https://doi.org/10.1109/TCPMT.2020.3019275
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    A rapid method based on activation energy values for the lifetime assessment of PP films used as dielectrics for capacitors is proposed. The activation energy is determined from a nonisothermal measurement made by differential scanning calorimetry and an aging test at a single elevated temperature. The use of the onset temperature of the exothermal peak is proposed to evaluate the activation energy of the degradation of the PP film. Four types of PP film capacitors were thermally aged at 100 degrees C for different aging times. For each aging time, the capacitance was measured at different frequencies. According to the standards, two end-of-life criteria (2% and 5%) were imposed for the reduction in the capacitance. The parameters of the lifetime line a and b were determined, and finally, the lifetime values were calculated. The novel proposed method is effective in terms of both energy and manpower costs compared with the current method, which uses three aging temperatures.

Aplikace vodivých lepidel z pohledu termomechanických vlastností

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Vzorky připravené z elektricky vodivého lepidla byly analyzovány termomechanickou analýzou, dynamickou mechanickou analýzou, diferenciální skanovací kalorimetrií, termogravimetrií a také IR spektroskopií s Fourierovou analýzou. Byla zjištěna silná závislost mechanických vlastností na vytvrzování lepidla, dále nedostatečné vytvrzení vzorků a také zanedbatelný vliv vakua při vytvrzování vzorků.

Application of More-level Stress on Conductive Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Sokol, J.
  • Publikace: IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). Bucharest: Politehnica, 2019. p. 142-145. ISSN 2641-287X. ISBN 978-1-7281-3330-0.
  • Rok: 2019
  • DOI: 10.1109/SIITME47687.2019.8990770
  • Odkaz: https://doi.org/10.1109/SIITME47687.2019.8990770
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Three types of stresses have sequentially loaded adhesive joints formed of three types of adhesives with isotropic electrical conductivity. One type of joints has been prepared by mounting of jumpers (0R0 resistors, type 1206) on the test board. The second type of the joints has been formed by the printing of lines from adhesive between neighboring pads. The adhesive joints have been first stressed mechanically by deflection of the board with mounted resistors, then by the thermal shocks -40 oC/+80 oC and then at the combined climate 80 oC/80 % RH for 300 hours. The joints resistance has been measured. The mechanical stress, as well as stress caused by the thermal shocks have had an only low influence on the joints resistance, the combined climate temperature/humidity caused significant changes the joints resistance.

Elektricky vodivá lepidla pro elektrotechniku

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Jsou uvedeny základní informace o elektricky vodivých lepidlech pro elektrotechniku. Jsou popsány typy elektricky vodivých lepidel, jejich složení a základní vlastnosti. Je uveden mechanizmus vodivosti u elektricky vodivých lepidel s izotropní elektrickou vodivostí vycházející z dominantního mechanizmu vodivosti - tunelování. Jsou popsány vlastnosti lepených spojů při jejich zatěžování elektrickým proudem a při jejich klimatickém namáhání.

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

  • DOI: 10.1007/s10854-019-00784-5
  • Odkaz: https://doi.org/10.1007/s10854-019-00784-5
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The characterization of glass transition temperature (Tg) was performed for one- and two-component electrically conductive adhesive used in electronic joining technologies. Both adhesives were of the epoxy type with the silver filler. Dynamic mechanical analysis (DMA) was used to measure the Tg. The adhesives were modified with nanoparticles, namely, carbon nanotubes (concentration of 0.5 and 0.8% by weight) and silver nanoballs (2.5% by weight). The values of Tg were determined from the plot of the Tg δ parameter. Two types of environmental stresses were used for climatic aging: 125 °C/56% RH and 85 °C/85% RH. The aging of the samples at 125 °C and 56% RH caused increase Tg for all formulations.

Influence of temperature shocks on climatic aging of conductive adhesive joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Závora, F.
  • Publikace: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2019. p. 297-300. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1.
  • Rok: 2019
  • DOI: 10.1109/ISSE.2019.8810175
  • Odkaz: https://doi.org/10.1109/ISSE.2019.8810175
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Conductive joints formed from electrically conductive adhesives with isotropic electrical conductivity were aged using temperature shocks. The joints were exposed by 10 or 40 shocks -40/+80 oC. The exposure time of the samples at each temperature was 15 minutes; the time of the temperature change did not exceed 10 seconds. Then the joints were climatic treated at 80 oC/80 % relative humidity for 168 and 336 hours, respectively. It was found a small influence of the shocks on the resistance and climatic aging of the joints.

Loss factor and non-linearity of volt-ampere characteristic of capacitors from metalized PP film

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. Martin Horák, Ph.D.,
  • Publikace: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2019. p. 292-296. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1.
  • Rok: 2019
  • DOI: 10.1109/ISSE.2019.8810267
  • Odkaz: https://doi.org/10.1109/ISSE.2019.8810267
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Capacitors manufactured from the polypropylene film are high-quality components having a very low loss factor and nonlinearity of the current-voltage characteristic. Dependence of these parameters on the time of thermal aging of the PP capacitors at the temperature100 oC were inspected. It was found small deteriation of the loss factor and more significant changes of the nonlinearity during long-time aging at this temperature.

Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S.
  • Publikace: IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). Bucharest: Politehnica, 2019. p. 118-121. ISSN 2641-287X. ISBN 978-1-7281-3330-0.
  • Rok: 2019
  • DOI: 10.1109/SIITME47687.2019.8990752
  • Odkaz: https://doi.org/10.1109/SIITME47687.2019.8990752
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Modification of electrically conductive adhesive by adding silver nanoparticles in low concentration with the goal to improve mechanical/electrical properties was carried out. The goal of the work was to find how concentration and quality of mixing the nanoparticles into the adhesive influence the resistance of adhesive joints. Then modified adhesives were aged at the high temperature (125 oC, 45 % RH) and the high relative humidity (98 % RH, 24 oC). It was found that mixing and moisture have a significantly greater effect on increasing the joint resistance than the temperature.

Changes of loss factor of polypropylene film capacitors during long time thermal ageing

  • DOI: 10.1109/DIAGNOSTIKA.2018.8526139
  • Odkaz: https://doi.org/10.1109/DIAGNOSTIKA.2018.8526139
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Capacitors made of a polypropylene film are high-quality components having self-leading ability and low loss factor. The work was oriented on study of percentage changes of the loss factor of the PP film capacitors during long-time thermal treatment at 100 oC. The capacitance of the capacitors was 100 nF, the class of the capacitors was X2. The loss factor was inspected at the frequency of 1 kHz, 10 kHz, 100 kHz and 1 MHz. It was found low changes of the loss factor only that depend slightly on the value of the loss factor at the beginning of the test.

Effects of high current density on lead-free solder joints of chip-size passive SMD components

  • Autoři: Geczy, A., Straubinger, D., Kovacs, A., Krammer, O., doc. Ing. Pavel Mach, CSc., Harsányi, G.
  • Publikace: Soldering & Surface Mount Technology. 2018, 30(2), 74-80. ISSN 0954-0911.
  • Rok: 2018
  • DOI: 10.1108/SSMT-10-2017-0032
  • Odkaz: https://doi.org/10.1108/SSMT-10-2017-0032
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper presents a novel approach on investigating critical current densities in the solder joints of chip-size SMD components. The investigation involves a numerical approach and a physical validation with selected track-to-pad connections and high current loads. It was found that the inhomogeneity in current density depends on the track-to-pad structure of the joint. Also it was found, that the heavy current load decreases the mechanical strength, but the degradation does not reach the level of electromigration-induced voiding.

Influence of Surface Finish and Additional Curing on Resistance of Adhesive Conductive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Žalská, P.
  • Publikace: 2018 International Conference on Diagnostics in Electrical Engineering (Diagnostika). Prague: Czechoslovakia Section IEEE, 2018. p. 94-97. ISBN 978-1-5386-4424-9.
  • Rok: 2018
  • DOI: 10.1109/DIAGNOSTIKA.2018.8526123
  • Odkaz: https://doi.org/10.1109/DIAGNOSTIKA.2018.8526123
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Conductive adhesive joints were manufactured by adhesive assembly of jumpers of the type 1206 on copper and gold pads. The resistance of the joints was measured and influence of different surfaces on the resistance value was evaluated. Then the joints were additionally cured and changes of the joints resistance caused by this curing was examined. It was found that the influence of the pad surface finish has low influence of the joint resistance, whereas the additional curing can change the resistance significantly.

Resistance and N onlinearity of Current - Voltage C haracteristic of Conductive Adhesive Joints with Isotropic C onductivity : Tunnel Theory

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical conductivity of influenced by two types of resistances: by the constriction resistance and by the tunnel one. If adhesives with isotropic electrical conductivity are used for assembly, the tunnel resistance dominates in the total value of the resistance of an adhesive joint. Therefore, the adhesion joint is seen as an aggregate tunnel junction. The theory of conductivity of this junction emerges from the theoretical description of the tunnel phenomenon.

Solder joint quality evaluation based on heating factor

  • DOI: 10.1108/CW-10-2017-0059
  • Odkaz: https://doi.org/10.1108/CW-10-2017-0059
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

Analysis of Evaporation Process of Thin Ni Films by Factorial Experiments and Taguchi Approach

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S., Kocián, M.
  • Publikace: IEEE 23rd International Symposium for Design and Technology in Electronic Packaging. Cavallioti, 2017. p. 98-101. ISSN 2641-287X. ISBN 978-1-5386-1626-0.
  • Rok: 2017
  • DOI: 10.1109/SIITME.2017.8259866
  • Odkaz: https://doi.org/10.1109/SIITME.2017.8259866
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Process of evaporation of thin Ni films has been described using Full factorials experiments and Taguchi approach. Ni film have been evaporated from a tungsten evaporator on glass substrates. The thickness of evaporated films has been monitored in dependence on the mass of evaporated material, on the pressure in the vaccuum bell jar and on the temperature of the substrate. It was found that the dominant influence of the evaporated thickness has the evaporated mass and pressure in the recipient, the influence of the substrate temperature is very low.

Effect of Resistance of Conductive Adhesive Joint on Course of Its Ageing

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S.
  • Publikace: IEEE 23rd International Symposium for Design and Technology in Electronic Packaging. Cavallioti, 2017. p. 69-70. ISSN 2641-287X. ISBN 978-1-5386-1626-0.
  • Rok: 2017
  • DOI: 10.1109/SIITME.2017.8259865
  • Odkaz: https://doi.org/10.1109/SIITME.2017.8259865
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The influence of the adhesive conductive joint resistance on the course of its climatic ageing was inspected. Four types of conductive adhesives were used for manufacturing of adhesive joints. Three types of climatic ageing was used, at the temperature of 125 oC, at the combined climate 85 oC/85 % RH and at the humidity of 98 %. It was found that the influence of the joint resistance on the course of its climatic ageing is low.

Influence of Continual Mechanical Stress of Climatic Ageing of Conductive Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Žalská, P.
  • Publikace: 40th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE, 2017. ISSN 2161-2536. ISBN 978-1-5386-0582-0.
  • Rok: 2017
  • DOI: 10.1109/ISSE.2017.8000915
  • Odkaz: https://doi.org/10.1109/ISSE.2017.8000915
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Adhesive joints were prepared using four types of electrically conductive adhesives by adhesive assembly of 0R0 resistors on test-PCBs. The joints were mechanically loaded by deflection of the board. The mechanical stress caused increase of the joints resistances.

Relationships between Noise and Nonlinearity of Adhesive Conductive Joints and Joint Resistance

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S., Duraj, A.
  • Publikace: 40th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE, 2017. ISSN 2161-2536. ISBN 978-1-5386-0582-0.
  • Rok: 2017
  • DOI: 10.1109/ISSE.2017.8000914
  • Odkaz: https://doi.org/10.1109/ISSE.2017.8000914
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Noise and nonlinearity of the VA characteristic of a conductive adheisive joint are parameters that beside the joint resistance influence quality of a signal passing through the joint. There are studied relationships between these parameters in the article.

Analysis on Quality of Diagnostic Processes in Power Electrical Engineering using Combined Methods of Lead Six Sigma and Fuzzy Approaches

  • Autoři: doc. Ing. Pavel Mach, CSc., Tarba, L.
  • Publikace: 2016 Conference on Diagnostics in Electrical Engineering (Diagnostika). IEEE, 2016. pp. 146-149. ISBN 978-1-5090-6178-5.
  • Rok: 2016
  • DOI: 10.1109/DIAGNOSTIKA.2016.7736499
  • Odkaz: https://doi.org/10.1109/DIAGNOSTIKA.2016.7736499
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Process control is statistic and engineering discipline that deals with architectures, mechanisms and algorithms. It is significant to evaluate critical factors influencing quality of the process and to determine, which of them are leading to the failures. Combining of different types of quality methods and fuzzy mathematical tools has been examined fault tolerance design.

Application of 3D Printing in Electronics

  • Autoři: doc. Ing. Pavel Mach, CSc., Palkovský, T
  • Publikace: 2nd Flash Conference 2016, Book of Abstracts. Brno: CEITEC - Central European Institute of Technology, 2016. pp. 29-32. ISBN 978-80-214-5416-3.
  • Rok: 2016
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The difference between 2D printing and 3D printing is shown. Methods of 3D printing based on using liquid-based systems, powder-based systems and solid-based systems are presented and advantages and disadvantages of different methods are analyzed. The contemporary high-level technology based on aerostol jet printing is mentioned and its advantages in comparison with the old technologies are stressed.

Conductive Adhesive Joints under Combined Load

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S., Duraj, A.
  • Publikace: Proceedings of the International Spring Seminar on Electronics Technology. New York: IEEE Press, 2016. pp. 241-244. ISSN 2161-2536. ISBN 978-1-5090-1389-0.
  • Rok: 2016
  • DOI: 10.1109/ISSE.2016.7563197
  • Odkaz: https://doi.org/10.1109/ISSE.2016.7563197
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Resistance of adhesive joints under climatic load only and under climatic load applied after mechanical stress is examined. Three types of adhesives were tested, adhesive joints were manufactured by adhesive assembly of resistors 0R0 type 1206. It was found that the change in resistance of the joints loaded mechanically before the climatic load are greater than changes of the resistance of the joints without the mechanical load.

Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints

  • DOI: 10.1109/TCPMT.2016.2593709
  • Odkaz: https://doi.org/10.1109/TCPMT.2016.2593709
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    One of the most vulnerable components of electronic circuits is the solder joints. The most common technique of soldering used in electronics is the reflow soldering. During the soldering process, different issues may occur leading to the inception of some defects (tombstone effect, flux spattering, etc.). To avoid these defects, it is mandatory to follow the parameter values of the reflow process, especially temperature values. In this paper, the temperature distribution for three types of samples (two interconnected soldering pads–without solder, with solder on one pad, and with solder on both pads) during the reflow soldering process, calculated with Comsol Multiphysics software (heat transfer 3-D module) is presented. The calculated values are then compared to the ones obtained by experiments in order to verify the accuracy of the numerical model. To carry out the computations, the latent heat of melting/solidification and the variation with the temperature of the solder parameters were considered. The results show that there is a good correlation between the measured and calculated values, the differences (for all types of samples) being lower than ±3 °C.

Flux effect on void quantity and size in soldered joints

  • DOI: 10.1016/j.microrel.2016.03.009
  • Odkaz: https://doi.org/10.1016/j.microrel.2016.03.009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence.

Loss Factor of Alumina and AlN Thin Films Created by Reactive Magnetron Sputtering

  • Autoři: doc. Ing. Pavel Mach, CSc., Kolářová, J.
  • Publikace: Proceedings of the International Spring Seminar on Electronics Technology. New York: IEEE Press, 2016. pp. 378-381. ISSN 2161-2536. ISBN 978-1-5090-1389-0.
  • Rok: 2016
  • DOI: 10.1109/ISSE.2016.7563224
  • Odkaz: https://doi.org/10.1109/ISSE.2016.7563224
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Thin Al2O3 and AlN films have been created by reactive magnetron sputtering; oxygen and nitrogen have been used as working gases. The capacitors have been formed by evaporation of a strip across the Al electrodes with the dielectric film. Loss factor has been examined in dependence on the pressure of the working gas, the flow rate of the working gas and power of the generator. Conditions for producing of the films with the minimum loss factor have been found

Nonlinear Distortion of C/V Characteristic - Useful Tool for Diagnostics of Electrically Conductive Adhesives - Theoretical Background, Measuring Equipment, Selected Applications

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S.
  • Publikace: 2016 Conference on Diagnostics in Electrical Engineering (Diagnostika). IEEE, 2016. pp. 142-145. ISBN 978-1-5090-6179-2.
  • Rok: 2016
  • DOI: 10.1109/DIAGNOSTIKA.2016.7736501
  • Odkaz: https://doi.org/10.1109/DIAGNOSTIKA.2016.7736501
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adheisives are used in electrical engineering to substitute lead free solders for conductive joining of some components in electronics. Conductive network in adhesive is formed by conductive particles and tunnel junctions between them.

Optimization of PCB Assembly Process

  • Autoři: Tarba, L., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME). New York: IEEE, 2016. pp. 55-58. ISBN 978-1-5090-4446-7.
  • Rok: 2016
  • DOI: 10.1109/SIITME.2016.7777242
  • Odkaz: https://doi.org/10.1109/SIITME.2016.7777242
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The goal of the optimization was to decrease the total time of assembly and the number of failures on assembled PCBs and to increase of quality and reliability of the boards. A mathematical model for this optimization was calculated. As tools for optimizing a six sigma, lean six sigma, theory of constrains and fuzzy logic were used.

Sensitivity of Resistance, Noise and Nonlinearity of Conductive Adhesive Joints to Changes in Adhesive

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S.
  • Publikace: 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME). New York: IEEE, 2016. pp. 40-43. ISBN 978-1-5090-4446-7.
  • Rok: 2016
  • DOI: 10.1109/SIITME.2016.7777239
  • Odkaz: https://doi.org/10.1109/SIITME.2016.7777239
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives are materials used for conductive joining in electronics. Adhesive joints formed of adhesive based on bis-phenol resin were in the temperature of 125 oC, in the relative humidity/temperature 85 %/85 oC and in the relative humidity of 95 % for 1000 hours. The resistance, noise and nonlinearity of the joints were compared. The highest sensitivity to ageing was found for the resistance.

Influence fo Combined Ageing on Resistance and Noise of Electrically Conductive Adhesive Joints

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Four types of electrically conductive adhesives were used for adhsive assembly of resistors with "zero" resistance on the test PCB and the resistance and noise of adhesive joints were measured. Then the samples were aged at the 80 oC/80 % RH for 1000 hours and the electrical parameters were measured for 100, 300, 500, 750 and 1000 hours and their percentage changes were examined. It was found that the sensitivity of 1/f noise to changes of adhesive joints caused by climatic ageing is comparable with the sensitivity of joints resistances.

Properties of Tunnel Junctions with Alumina Barrier

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 38th International Spring Seminar on Electronics Technology (ISSE 2015). New York: Institute of Electrical and Electronics Engineers, 2015. pp. 267-271. ISBN 978-1-4799-8860-0.
  • Rok: 2015

Study of Thermal Ageing of Polypropylene Film Capacitors

  • DOI: 10.1109/SIITME.2015.7342295
  • Odkaz: https://doi.org/10.1109/SIITME.2015.7342295
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Polypropylene film capacitors manufactured by five different manufacturers were aged at the temperature of 100 deg. of C for 1600 hours. Changes of the capacitance the loss factor and nonlinearity of the current-voltage characteristic were examined during ageing.

Temperature distribution in solder joints during melting and solidification

  • Autoři: prof. Ing. Bc. Karel Dušek, Ph.D., Stancu, C., Notingher, P.V., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE 2015). New York: Institute of Electrical and Electronics Engineers, 2015. pp. 500-506. ISBN 978-1-4799-7514-3.
  • Rok: 2015
  • DOI: 10.1109/ATEE.2015.7133853
  • Odkaz: https://doi.org/10.1109/ATEE.2015.7133853
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The most vulnerable components of electronic circuits (PCA - Printed Circuit Assembly) are the solder joints. During the soldering process different anomalies may occur (changes in the reflow temperature profile, different cooling rates) leading to the inception of some defects, as excessive voids inside the solder, brittle phase formation, concentration gradients of elements or metallurgical composition etc. To avoid this, it is mandatory to follow the parameter values of the reflow process (speed, temperature values etc.). Temperature computing model for two PCA samples during the reflow soldering process, by using Comsol Multiphysics software (heat transfer 3 D module) is presented in this paper. PCA samples with and without resistor contains substrate with two soldering pads together with lead free solder. To carry out the computations, the latent heat of fusion/solidification and the variation with the temperature of the alloy parameters were considered. The results show that the presence of the resistor leads to the decrease of the temperature in the alloy during melting and its increase during solidification.

Thermal Ageing of Polypropylene Film Capacitors

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. Martin Horák, Ph.D., Stancu, C.
  • Publikace: 38th International Spring Seminar on Electronics Technology (ISSE 2015). New York: Institute of Electrical and Electronics Engineers, 2015. p. 272-276. ISBN 978-1-4799-8860-0.
  • Rok: 2015

Ageing of Self-healing Polypropylene Film Capacitors by Non-sinusoidal Voltage

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The goal of this work was to test ageing of capacitors with metalized polypropylene film by the sinusoidal and non-sinusoidal voltage and to find if the shape of the voltage waveform influences the ageing rate.

Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach

  • Autoři: Barto, Seba, doc. Ing. Pavel Mach, CSc.,
  • Publikace: Arabian Journal for Science and Engineering. 2014, 39(39), 4935-4944. ISSN 1319-8025.
  • Rok: 2014
  • DOI: 10.1007/s13369-014-1167-7
  • Odkaz: https://doi.org/10.1007/s13369-014-1167-7
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This paper examines the effects of the time and temperature of the curing process and the effect of the pad surface material on the electrical resistance of joints formed using electrically conductive adhesives (ECA). Two types of isotropic ECA, composed of a bis-phenol epoxy matrix filled with silver flakes, were tested. The experimental data were processed in two ways, by performing full factorial experiments (FFE) of the 23 type and by using an L4 type Taguchi orthogonal array, and the results were then compared. It was found that the joint resistance is mainly affected by the curing temperature, and is less dependent on the curing time and the surface material. The interactions between these factors have been analyzed through FFE. The results showed that the Taguchi method is quite precise for the main factors, but is insufficiently accurate for processes with significant numbers of interactions.

Examination of Influence of Electrical Stress on Parameters of PP Film Capacitors

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. Martin Horák, Ph.D.,
  • Publikace: 2014 IEEE 20th International Symposium for Design an d Technology in Electronic Packaging ( SIITME ). Bucharest: Politehnica, 2014. p. 51-54. ISSN 2641-287X. ISBN 978-1-4799-6962-3.
  • Rok: 2014
  • DOI: 10.1109/SIITME.2014.6966993
  • Odkaz: https://doi.org/10.1109/SIITME.2014.6966993
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    PP capacitors are capacitors of s special type, which makes self-healing of the capacitor possible. These capacitors are components of high quality with very low loss factor. The testing was carried out by the electrical stress. It was found that the changes are higher if the component is loaded by the AC or pulse voltage than DC load.

Study of Electrical Ageing of Polypropylene Film Capacitors using Third Harmonics Measurement

  • Autoři: Ing. Martin Horák, Ph.D., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2014 IEEE 20th International Symposium for Design an d Technology in Electronic Packaging ( SIITME ). Bucharest: Politehnica, 2014. p. 55-59. ISSN 2641-287X. ISBN 978-1-4799-6962-3.
  • Rok: 2014
  • DOI: 10.1109/SIITME.2014.6966994
  • Odkaz: https://doi.org/10.1109/SIITME.2014.6966994
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Polypropylene film capacitors were aged and the AC voltage and nonlinearity of their VA characteristic was investigated as a function of the time and other conditions of ageing. It was found that nonlinearity of the capacitors increases with the time of ageing and with the level of the voltage. It was also found that this parameter is more sensitive to the ageing of the component than the capacitance or the loss factor, what are the parameters, which are normally investigated.

Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The goal of this work was to find if the numer of components in one- and two-component conductive adhesives influences their thermomechanical properties. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. It was also found that all adhesives were not optimally cured through curing was carried out in accordance with recomendation of a producer of adhesives.

Affinity Diagram as a Risk Analysis Tool with Support of Fuzzy Logic

  • Autoři: Povolotskaya, E., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Advanced Science Letters. 2013, 19(8), 2391-2394. ISSN 1936-6612.
  • Rok: 2013
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper covers the area of a process risk analysis. A new approach based on the use of affinity diagram combined with fuzzy logic brings new light in this area. Combination of fuzzy logic and affinity diagram for a better solution of a risk analysis problem is presented in this paper. An affinity diagram for a process was created. Process steps, operations and potential failures in these parts of a process were estimated. Significance of the failures was described using fuzzy logic. This way made a deeper process analysis possible. Fuzzy logic combined with the affinity diagram provides in-depth review of the process and mainly shows the degree of an influence of the failures on further steps and operations of the process. It can detect occurrence of new failures as well. New approach based on combination of a risk analysis tool – affinity diagram – with support of fuzzy logic is generic and can be applied to any technological or production process.

Ageing of Tunnel Junctions Formed in Oxygen Plasma and in Air

  • Autoři: doc. Ing. Pavel Mach, CSc., Rozkošný, T.
  • Publikace: Proceedings of the International Spring Seminar on Electronic Technology. New York: IEEE, 2013. pp. 152-156. ISSN 2161-2528. ISBN 9781479900367.
  • Rok: 2013
  • DOI: 10.1109/ISSE.2013.6648233
  • Odkaz: https://doi.org/10.1109/ISSE.2013.6648233
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Ageing of tunnel junctions of the type Al-Al2O3-Pb in laboratory conditions was examined. The alumina insulating barrier was formed by two methods: by oxidation of the basic Al electrode in oxygen and by oxidation in air . It was found that the junctions with the alumina barrier formed in plasma aged faster than those with the barrier formed in air. The reason is that the films formed in oxygen plasma are more porous in comparison with the films formed in air and therefore are more prone to oxidation.

Current Loading of Adhesive Joints Aged in Environment with High Humidity

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesive with epoxy matrix and silver filler was used for forming of adhesive joints. The joints were at first aged at the humidity near 100 % for 300 hours. The joints were then loaded with the rectangular current pulses with the amplitude 10 A, 20 A and 50 A. The width of the pulses was 5 microseconds, the frequency 50 Hz. It was found that the pulses changed the joints resistance.

Diagnostic of Electrical Properties of Electrically Conductive Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical properties of electrically conductive adhesives are the DC resistance, the impedance, noise and nonlinearity od the current vs. voltage characteristic. The methods of measurement of these parameters are described - four termination and three termination measurement of the resistance, the impedance measurement, the current noise measurement and the odd and even nonlinearity measurement. Results of some basic types of the measurements are presented graphically.

Electrically Conductive Adhesives Usability for Power Electronic Packaging

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Diagnostika 2013. Pilsen: University of West Bohemia, 2013. pp. 18-21. ISBN 978-80-261-0210-6.
  • Rok: 2013
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Application of electrically conductive adhesives for electronics packaging is joined with many problems. The great one is low endurance against humidity ageing and the combined ageing (humidity+temperature ageing). Five electrically conductive adhesives based on epoxy matrix and filled with silver flakes were under test. The limit of the use was found in the penetration of the water molecules into the matrix rezin. Water causes degradation of contacts between filler particles and degradation of the electrical as well as mechanical properties of the adhesive joints.

Influence of Filler Concentration on Frequency Dependence of Electrically Conductive Adhesive Joints Impedance

  • DOI: 10.1109/SIITME.2013.6743648
  • Odkaz: https://doi.org/10.1109/SIITME.2013.6743648
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Impedance of nine types of electrically conductive adhesives of epoxy type with silver filler was measured at the frequency range of 20 Hz to 1 MHz with the goal to find if the filler concentration can influence the the frequency dependence of the joint impedance, due to the formation of the conductive net in the joint of the filler particles. Concentration of filler particles was in the range of 60 to 75 % (b.w.). It was found that the filler concentration influences the frequency dependence of the joint impedance, but the influence is not too high.

Influence of nanoparticle additives on change of the glass transition temperature of electrically conductive adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    After elimination of lead from soft solders used for the electrical industry had to find new alternatives for creating electrically conductive connections. For some time no, one of the widespread options is using lead-free solders. Also another alternative comes to the fore. This alternative is using electrically conductive adhesives. The quality of their electrical and mechanical properties far does not reach the quality of lead-free solders. And therefore they are used only on places where is necessary.

Monitoring of Metalized Film Capacitors Degradation with Impedance Nonlinearity Measurement

  • DOI: 10.1109/SIITME.2013.6743687
  • Odkaz: https://doi.org/10.1109/SIITME.2013.6743687
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Six capacitors of metalized polymer film were measured - nonlinearity of impedance was investigated. Then the capacitors were thermally aged at the temperature of 90 oC for the time of 300 hours and the measurement of nonlinearty was repeated. It was found that the temperature ageing of capacitors causes change of the nonlinearity. The cause is change of the structure of the thin film electrode caused by ageing. This approach could be used to inspection of level of ageing of the capacitors as well as to forecast of the rest life-time of the capacitors.

Study of Sputtering Process of Alumina Thin Films

  • Autoři: doc. Ing. Pavel Mach, CSc., Kocian, M., Kolářová, J.
  • Publikace: Proceedings of the International Spring Seminar on Electronic Technology. New York: IEEE, 2013. pp. 247-252. ISSN 2161-2528. ISBN 9781479900367.
  • Rok: 2013
  • DOI: 10.1109/ISSE.2013.6648251
  • Odkaz: https://doi.org/10.1109/ISSE.2013.6648251
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Samples for inelastic electron tunneling spectroscopy are thin film capacitors with alumina dielectrics. Measured material is applied onto this dielectrics. One of common technologies of alumina film preparation is magnetron sputtering. Properties of the film influence properties of the tunneling junction significantly. Therefore a mathematical model of the process of magnetron sputtering of these films was created using factorial experiments.The model makes manufacturing of the films with requested properties and high accuracy possible.

Testing of Usability of Tabbing Ribbons Adhesive Assembly in PV Modules Production

  • Autoři: doc. Ing. Pavel Mach, CSc., Janák, J.
  • Publikace: Proceedings of the International Spring Seminar on Electronic Technology. New York: IEEE, 2013. pp. 85-89. ISSN 2161-2528. ISBN 9781479900367.
  • Rok: 2013
  • DOI: 10.1109/ISSE.2013.6648220
  • Odkaz: https://doi.org/10.1109/ISSE.2013.6648220
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Adhesive joining was tested as a possible alternative to lead fee soldering in photovoltaic modules production for assembly of tabbing ribbons. The ribbons have mostly lead free solder surface finish. One-component and two-component epoxy resin filled with silver flakes were used for experiments. Adhesive joints were formed by assembly of jumpers on pads with lead free solder surface finish.

FMEA and FTA Analyses of the Adhesive Joining Process using Electrically Conductive Adhesives

  • Autoři: Povolotskaya, E., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Acta Polytechnica. 2012, 52(2), 48-55. ISSN 1210-2709.
  • Rok: 2012
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This paper introduces a formulation of appropriate risk estimation methods that can be used for improving of processes in the electronics area. Two risk assessment methods have been chosen with regard to the specifics of adhesive joining based on electrically conductive dhesives. The paper provides a combination of a failure mode and effect analysis (FMEA) and fault tree analysis (FTA) for optimizing of the joining process.

Fuzzy Risk Analysis Approach Test-Case: Lead-Free Soldering Process

  • Autoři: Povolotskaya, E., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 35th International Spring Seminar on Electronics Technology. Wien: Technische Universität, 2012. p. 260-265. ISSN 2161-2528. ISBN 978-1-4673-2240-9.
  • Rok: 2012
  • DOI: 10.1109/ISSE.2012.6273083
  • Odkaz: https://doi.org/10.1109/ISSE.2012.6273083
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Increasing complexity of technological processes imposes considerable incertainities and subjectivities in risk analyses of these processes. Paper integrates the use of fuzzy logic and FMEA expert database. The analyse of lead - free soldering processes is carried out using fuzzy FMEA approach, which partially suppresses the above mentioned drawbacks.

Quality management from the perspective of model based Project Management framework

  • DOI: 10.1109/ISSE.2012.6273079
  • Odkaz: https://doi.org/10.1109/ISSE.2012.6273079
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The main idea behind of this paper is aimed to improve PM (Project Management) in the field of product design, concretely in the branch of packaging with employing a Model Based (in other words Model Driven) approach. We propose a modern and innovative project management framework covering entire life cycle of manufacturing project. This original approach, a novelty of the Authors, contributes to more efficient project management of manufacturing process. It also increases quality, reliability and testing-capability of particular project process. Further, the Authors describe selected software and methodical tools suitable for the support of the process. Finally, a brief description of Model Based Project Management Framework (MBPMF) is set and some future directions of further research are indicated

Study of Curing Process of Electrically Conductive Adhesives Using Differential Scanning Calorimetry

  • Autoři: doc. Ing. Pavel Mach, CSc., Povolotskaya, E.
  • Publikace: 35th International Spring Seminar on Electronics Technology. Wien: Technische Universität, 2012. pp. 248-253. ISSN 2161-2528. ISBN 978-1-4673-2240-9.
  • Rok: 2012
  • DOI: 10.1109/ISSE.2012.6273081
  • Odkaz: https://doi.org/10.1109/ISSE.2012.6273081
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The curing process of electrically conductive adhesives was examined using differentia scanning calorimetry. It was found that some formulations were not well cured even though they were cured in accordance with the curing schedule of a producer.

Study of Glass Transition Temperature of Electrically Conductive Adhesives

  • DOI: 10.1109/SIITME.2012.6384364
  • Odkaz: https://doi.org/10.1109/SIITME.2012.6384364
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives with epoxy matrix and filled with silver flakes were modified with addition of multi-walled carbon nanotubes and with silver nanoparticles. Glass transition temperature was studied using dynamic thermomechanical analysis in penetration mode. It was found that the glass transition temperature increases after temperature ageing and decreases after humidity and temperature/humidity ageing.

Climatic Resistance of Electrically Conductive Adhesive Modifield with Silver Nanoparticles

  • Autoři: Barto, S., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 34th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2011. p. 144-145. ISBN 978-1-4577-2111-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    A part of silver flakes in electrically conductive adhesive with isotropic electrical conductivity was substituted with silver nanoparticles. Three concentrations of nanoparticles in adhesive were tested. Adhesive joints formed of this way modified adhesives were formed and tested in different climatic conditions. It was found that addition of nanoparticles does not cause dramatic changes in electrical properties of adhesive.

Conductive Mechanisms in Electrically Conductive Adhesives with Isotropical Electrical Conductivity

  • Autoři: doc. Ing. Pavel Mach, CSc., Cinert, J.
  • Publikace: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging. Timisoara: University Politehnica Timisoara, 2011. pp. 103-106. ISBN 978-1-4577-1275-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives with isotropical electrical conductivity have complicated conductive mechanism based on density and quality of conductive net inside adhesive. Two mechanisms influence adhesive resistivity dominantly: tunnel reistance and constriction resistance. It was found that the tunnel mechanism influences resistivity of adhesive dominantly.

Control Tools for Process Improvement in Electrical Engineering

  • Autoři: Tarba, L., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 34th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2011. p. 254-255. ISBN 978-1-4577-2111-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    There are different types of tools for improvement production processes in electrical engineering. These tools are statistical and managerial. The paper describes some of the newer approaches, which provide a new prospective on process control beyond the present SPC. Paper shows the unique set of methods applicable especially for processes in electronics.

Correlations between Mechanical and Electrical Parameters of Modified Electrically Conductive Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesive with isotropic electrical conductivity was modified with addition of silver nanoparticles. Contrast in electrical resistance and shear strength of adhesive joints formed of non-modified and modified adhesive was investigated.

Electrically Conductive Adhesive with Micro-Nano Filter

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: NANOCON 2011 Conference Proceedings. Ostrava: Technická universita Ostrava - Vysoká škola báňská, 2011. pp. 38. ISBN 978-80-87294-23-9.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Properties of electrically conductive adhesive with bis-phenol epoxy matrix and silver micro-nano filler were examined. It was found that addition of silver nano-particles into standard adhesive filled with silver micro-flakes does not improve its electrical properties.

Electrically Conductive Adhesives Modified Using Ions and Nanoparticles

  • Autoři: Ing. David Bušek, Ph.D., Pilarčíková, I., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Nanocon 2011, Conference Proceedings. Ostrava: Technická universita Ostrava - Vysoká škola báňská, 2011. pp. 397-402. ISBN 978-80-87294-23-9.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The general goal of this work is to improve electrical conductivity which is nowadays up to two orders worse when compared to lead or lead free solders. This work summarizes the results of experiments, where two basic adhesives AX20 and AX70MN are either additionally filled with silver nanoparticles, carbon nanotubes or AgNO3, or modified using nitric acid (HNO3), chloride acid (HCl), potassium cyanide (KCN) or treated with elevated temperature (200 °C) for the duration of 20 minutes (annealed).

Failure Analysis of Adhesive Joining in Electronics

  • Autoři: Povolotskaya, E., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 34th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2011. p. 244-245. ISBN 978-1-4577-2111-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Article is focused on formulation of appropriate risk estimation methods and procedures that enables involving it to production process in electronics area. Two methods for risk assessment have been chosen with regard to the specifics of contuctive joinig bases on electrically conductive adhesives.

Image analysis of lead free solders

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Article deals with actual problem of lead free soldering and solves issue of image analysis of lead free solders and soldering process. For image analysis was used special software - NIS elements. In concrete article deals with image analysis of spread factor, observation of creation and growth of tin whiskers from surface finishes, analysis of manufacturing technologies (vapor soldering, hot air soldering) of soldered joints, cross sections of soldered and adhesive joints etc.

Influence of Surface Finish on Resistance of Contacts between ECA and Pad

  • Autoři: doc. Ing. Pavel Mach, CSc., Cinert, J.
  • Publikace: 34th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2011. p. 170-171. ISBN 978-1-4577-2111-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Contact resistance between adhesive and pad is examined. Three types of adhesives based on bis-phenol epoxy resin matrix filled with silver flakes are studied on copper, nickel and gold surface finishes. The contact resistance is calculated and difference between contact resistances is measured. Resistances of copper and gold finishes are the lowest.

Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives

  • Autoři: Barto, S., Cinert, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging. Timisoara: University Politehnica Timisoara, 2011. pp. 305-308. ISBN 978-1-4577-1275-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives are environmental friendly materials for conductive joining in electronics. Adhesives based on bis-phenol epoxy resin filled with silver flakes with concentration from 65 to 80 % (by wt.) were used for experiments. Conductive joints were formed of these adhesives and thermally aged at the temperature of 120 oC. It was found that the conductivity of adhesives slightly increased after ageing.

Kontrol kachestva technologicheskogo protsesa proizvodstva pechatnyh plat v elektronike

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Jelektronika - jeto otrasl', gde tehnicheskoe i tehnologicheskoe razvitie proishodit bystree vsego. Pod vlijaniem povyshenija funkcional'nosti, miniatjurizacii, obespechenija nadezhnosti passivnye i aktivnye komponenty integrirujutsja v strukturu pechatnyh plat, i v blizhajshee vremja budet dostatochno tjazhelo provesti granicu mezhdu otdel'nymi komponentami i pechatnoj platoj. Kontrol' kachestva v proizvodstve jelektronnyh komponentov ves'ma suwestvenen i neobhodim. Jeta stat'ja predstavljaet ko vnimaniju razlichnye metody upravlenija processov proizvodstva pechatnyh plat, kotorye mogut byt' ispol'zovany dlja sovershenstvovanija proizvodstvennyh processov v oblasti jelektroniki.V processe proizvodstva pechatnyh plat mozhno stolknut'sja s rjadom trudnostej, sredi kotoryh - razlichnye harakteristiki produktov,sochetanie raznyh tehnologij i tipov soedinenija, a takzhe razlichnyj harakter processov.Suwestvuet neskol'ko tipov instrumentov dlja kontrolja proizvodstvennogo processa: statisti

Modification of Interfacial Properties Between Filler Particles in Electrically Conductive Adhesive

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. David Bušek, Ph.D.,
  • Publikace: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging. Timisoara: University Politehnica Timisoara, 2011. pp. 99-102. ISBN 978-1-4577-1275-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives are materials filled with different types of conductive particles, with the silver flakes usually. Interfacital properties between particles influence quality of contacts between particles and electical properties of adhesive joints. Different ways of modification of interfacial properties were tested: rotary stiring of adhesive before application, addition of bi-carboxylic acid into adhesive before application and additional curing of the joints were tested. It was found that rotary stiring before application of adhesive is the most effective way for improvemet electrical conductivity of adhesive.

Process Control of Printed Circuit Board Manufacturing in Electronics

  • Autoři: Tarba, L., Zhuravskaya, O., doc. Ing. Pavel Mach, CSc.,
  • Publikace: InterTech 2011. Poznaň: Poznan University of Technology, 2011. pp. 144-147. ISBN 978-83-926896-3-8.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The need for quality control in the manufacture of electronic components is well accepted. This paper represents different methods for controlling manufacturing process of printed circuit boards (PCB) which can be used for improvement of a production processes in electronics area. PCB fabrication involves more than a hundred process steps. These range from creating photo-tooling, to a variety of chemical cleaning steps, plating steps, drilling and other. During the manufacturing process quite a bunch of difficulties can be met, such as product characteristics, process parameters to be measured and charted, the mix of different manufacturing technologies and the interconnecting nature of the processes. There are several types of tools for controlling the manufacturing process, among them are: statistical, manual, computer supported, etc. This paper describes some of the newer approaches and techniques which are showing the unique set of methods for improving PCB manufacturing process - control charts as one of the statistical tools, robust design, error-proofing, autonomous control and reliability method. Specifically the paper will provide some guidelines used for statistical process control implementation and various designs of experiments. Though the paper is not only concentrated on showing some recent innovative implementation procedures of statistical process control, but also a wide range of strategies not concerning only SPC (statistical process control) paradigm.

Properties of Modified Electrically Conductive Adhesives

  • Autoři: Ratislav, M., Pilarčíková, I., Ing. David Bušek, Ph.D., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Nanocon 2011, Conference Proceedings. Ostrava: Technická universita Ostrava - Vysoká škola báňská, 2011. pp. P50/1-P50/5. ISBN 978-80-87294-23-9.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This work deals with electrical properties of electrically conductive adhesives.The aim of this work is the measurement of electrical resistance and non-linearity of connections created with isotropic conductive adhesives and compare changes in these variables after adjusting adhesives by adding silver nitrate and its subsequent annealing.AX 20 and AX 70MN adhesives with similar composition were used, but AX 70MN is more pourable, which could take influence to results, especially in case of annealing and shouldering of PCB. Further aim was improvement of adhesive properties by adding not only silver nitrate but also dissolvent, which allows better dissociation.

Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging

  • Autoři: Barto, S., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging. Timisoara: University Politehnica Timisoara, 2011. pp. 59-62. ISBN 978-1-4577-1275-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesive based on epoxy resin matrix with silver filler was used for formation of adhesive joints, which were aged at the higher temperature and humidity. Resistance and nonlinearity of current vs. voltage characteristic were measured and results found before and after ageing were compared. It was found that combined ageing causes increase of resistance and non-linearity of adhesive joints.

Study on the Effect of Addition of Spherical Silver Nanoparticles into Electrically Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Diagnostika '11. Plzeň: Západočeská univerzita v Plzni, 2011. pp. 126-129. ISBN 978-80-261-0020-1.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesive was modified by addition of three types of spherical nanoparticles with differend diameters in three differend concentrations. Resistance of adhesive joints formed of these formulations were investigated. It was found that the resistance moustly increases.

Study on the Effect of Addition of Spherical Silver Nanoparticles into Electrically Conductive Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Addition of spherical silver nanoparticles into electrically conductive adhesives improves mechanical properties of adhesives but worses their electrical conductivity and nonlineatity of the current versus voltage characteristic. The reason of these changes is growth of the number of contacts in electrically conductive net in adhesive.

Success Case-Study Lean Production in Electronics Manufacturing Workshop

  • Autoři: Zhuravskaya, O., Michajlec, M., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 34th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2011. p. 234-240. ISBN 978-1-4577-2111-3.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Case study of lean production was applied for one the biggest automotive electronics producer. The aim of the study was to show electronic production increasing productivity based on scientific labor management. It was demonstrated the advantages of lean production for arrangement of a workplace from the point of view of effectiveness of production and area necessary for the workplace.

Synergy Effect of Failure Mode and Effect Analysis and Fault Tree Analysis for Adhesive Joining Optimization

  • Autoři: Povolotskaya, E., doc. Ing. Pavel Mach, CSc.,
  • Publikace: InterTech 2011. Poznaň: Poznan University of Technology, 2011. pp. 126-130. ISBN 978-83-926896-3-8.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper introduces formulation of appropriate risk estimation methods and procedures that can be used for improvement of a production processes in electronics area. Two methods for risk assessment were chosen with regard to the specifics of adhesive joining based on electrically conductive adhesives. The paper provides an implementation of step-by-step risk analysis procedure using a FMEA, and FTA methods for optimization of this process. Typical features and failures of the process were identified using failure mode and effect analysis, as the first tool. Critical operations were found and actions, how to avoid failures in these actions, were proposed. The results of failure mode and effect analysis were used for construction of a fault-tree model. All main differences between failure mode and effect analysis and fault tree analysis were defined and it was sorted out how to use both techniques complementing each other for synergy achievement and getting more efficient results.

The Ontology based FMEA of Lead Free Soldering Process

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The idea behind of the paper is aimed to improve FMEA (Failure mode and Effects Analysis) process in the field of reflow lead free soldering with using the ontology paradigm. Some of FMEA software tools and ontology editors are described in order to disclose the essence of an FMEA based on ontology. Also for comparison we present a description of FMEA analysis of a lead-free soldering process without the use of ontology based approach.

Theoretical Study of Lean Production and its Application in Electronics Production

  • Autoři: Zhuravskaya, O., Michajlec, M., doc. Ing. Pavel Mach, CSc.,
  • Publikace: InterTech 2011. Poznaň: Poznan University of Technology, 2011. pp. 408-412. ISBN 978-83-926896-3-8.
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper describes the core idea of Lean production as a methodology with series of tools for continuous improvement in the electronics manufacturing. The main idea is to show the electronics production increasing profitability based on scientific labor management and demonstrating the advantages of their usage for workers in operation. Main optimization parameters for production line were chosen and analyzed with regard to the specifics of automotive electronics production. The paper provides an implementation of step-by-step line optimization procedure using main Lean tools. One of the biggest automotive electronics suppliers in the world was under observation and Lean production optimization was considered on one of the production lines. Paper sums up the matters deserving attention in the Lean production implementation course to provide experience for companies working in electronics production and who are going to apply Lean production in the future.

Uspeshnoe vnedrenie printsipov Berezlivogo Proizvodstva na predpriyatiyah po proizvodstvy avtomobil'noj elektroniki

  • Autoři: Zhuravskaya, O., doc. Ing. Pavel Mach, CSc., Michajlec, M.
  • Publikace: Vychislitelnye seti. Teoriya a praktika. 2011,
  • Rok: 2011
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    V stat'e opisyvaetsja primer vnedrenija v jelektrotehnicheskom proizvodstve metodologii Berezhlivogo proizvodstva. Osnovnaja ideja dannogo issledovanija - pokazat', kak mozhno povysit' rentabel'nost' jelektrotehnicheskogo proizvodstva na osnove nauchnyh metodov upravlenija truda i prodemonstrirovat' preimuwestva ih ispol'zovanija. Vnedrenie metodologii Berezhlivogo proizvodstva proishodilo na proizvodstvennoj linii zavoda, kotoryj javljaetsja odnim iz krupnejshih v mire postavwikov avtomobil'noj jelektroniki. S uchetom specifiki proizvodstva jelektroniki dlja avtomobilej byli vybrany i proanalizirovany osnovnye parametry optimizacii proizvodstvennoj linii. V stat'e opisano poshagovoe ispol'zovanie osnovnyh instrumentov Berezhlivogo proizvodstva. V zakljuchenii rezjumirujutsja prakticheskie rezul'taty ispol'zovanija metodologii Berezhlivogo proizvodstva, kotorye budut polezny kompanijam Rossijskogo rynka.

Comparison of Different Approaches of Manufacturing Process Optimization

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S.
  • Publikace: SIITME 2010 Abstract Proceedings. Pitesti: University of Pitesti, 2010. pp. 204-205. ISBN 978-1-4244-8124-8.
  • Rok: 2010
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    There are many process variables, which less or more influence quality of the manufacturing processes. The control of these variables is a multi-parametric task. The use of factorial experiments Taguchi approach were compared from the point of view of number of experiments requeated.

Diagnostika a optimalizácia použitia ekologických materiálov pre vodivé spájanije v elektronike

  • Autoři: Pietriková, A., Ďurišin, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Košice: Technical University of Košice, 2010. Equilibria, s.r.o., Košice. vol. 1. ISBN 978-80-553-0447-2.
  • Rok: 2010
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Monografie popisuje základní techniky ekologického elektricky vodivého spojování pro elektroniku. Jsou rozebrány parametry vodivého pájení a jejich vliv na kvalitu spojů a parametry vodivého lepení a jejich vliv na kvalitu spojů.

Influence of Curing Process Parameters on Quality of Electrically Conductive Joints

  • Autoři: Barto, S., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 33rd International Spring Seminar on Electronics Technology. New York: IEEE, 2010. pp. 147-150. ISBN 978-1-4244-7849-1.
  • Rok: 2010
  • DOI: 10.1109/ISSE.2010.5547278
  • Odkaz: https://doi.org/10.1109/ISSE.2010.5547278
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more important for achievement of the low electrical resistance and low nonlinearity of a current vs. voltage characteristic of an adhesive joint.

Modification of Adhesive Joints Resistance with Current Pulses

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Two groups of identical strip of electrically conductive adhesive were printed on a test PCB. The strip resistance was measured by the four-terminal method, the resistance of the contact between the strip and pads was measured in parallel with the temperature growth. It was found that the resistance at first falls down and then growths rapidly with the temperature growth.

Optimization of Lead-Free Wave Soldering Process Using Taguchi Orthogonal Arrays

  • Autoři: doc. Ing. Pavel Mach, CSc., Barto, S.
  • Publikace: Conference ESTC 2010 in Berlin. Berlin: TU Berlin, 2010. pp. 47-50. ISBN 978-1-4244-8555-0.
  • Rok: 2010
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Process of wave soldering was optimized using Taguchi orthogonal arrays. Arrays L4 was used for optimization. Significance of parameters of soldering for joint quality was found.

Processing of Experimental Data Using Taguchi Orthogonal Array

  • Autoři: Barto, S., doc. Ing. Pavel Mach, CSc.,
  • Publikace: EDS 2010 Electronic Devices and Systems. Brno: VUT v Brně, FEI, Ústav mikroelektroniky, 2010. pp. 11-15. ISBN 978-80-214-4138-5.
  • Rok: 2010
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This paper deals with processing of experimental data using Taguchi Orthogonal array type L4. Experimentation means testing combinations of different values or levels of factors, which have an effect on quality characteristic. Taguchi approach is applied on data obtained from measurements of the resistance of adhesive joints cured under different conditions. Taguchi approach is substantially more effective in comparison with full factorial experiments.

Solderability Measurement of Copper with Different Surface Finishes

  • DOI: 10.1109/ISSE.2010.5547267
  • Odkaz: https://doi.org/10.1109/ISSE.2010.5547267
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders (Sn63Pb37, Sn95,5Ag3,8Cu0,7), two types of fluxes (94-RXZM (IPC-ANCI-J-STD-004 - REL0), 323-ITV (C-ANCI-J-STD-004 - REL1)) and as testing material we used one-side plating PCB (FR4) with four types of surface finishes (pasivated copper, H.A.L, immersion tin, chemical gold plating). For the measurement we have used one of the commonly used wettability evaluation methods - wetting balance (meniscograph) method. We marked the wettability, according to the shape of wetting curve, for each testing combination and sorted them into the table.

The Ontology based FMEA of Lead Free Soldering Process

  • DOI: 10.1109/ISSE.2010.5547322
  • Odkaz: https://doi.org/10.1109/ISSE.2010.5547322
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention are discussed. Particular phases of ontology utilization for development of more exact approach to the FMEA procedure of reflow lead free soldering are analyzed. The goal of our work, a proposal of a user's guide for the FMEA procedure based on an ontology paradigm is presented. This user's guide is included in our university courses Management of Production Quality and Complex Quality Control provided by the Department of Electrotechnology of our faculty.

Thermal Ageing of Electrically Conductive Micro/Nano Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Tempereture ageing of electrically conductive adhesives in dependence on the temperature and time of ageing was examined. Basic electrical parameters of adhesives were measured. Improvement and decrease of these parameters were found independence on the temperature curring of adhesives.

Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used.

Thermomechanical Analysis of Electrically Conductive Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Termomechanical analysis of elektrically conductive adhesives was carried out. Methods of static and dynamic thermomechanical alanyses as well as method of differential scanning calorimetry were used. It was found that adhesives vere not fully curred.

Tolerance Design of Curing Process of Electrically Conductive Adhesives

  • Autoři: Barto, S., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 33rd International Spring Seminar on Electronics Technology. New York: IEEE, 2010. pp. 103-106. ISBN 978-1-4244-7849-1.
  • Rok: 2010
  • DOI: 10.1109/ISSE.2010.5547265
  • Odkaz: https://doi.org/10.1109/ISSE.2010.5547265
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The work was directed at examination of influence of tolerances of curing process parameters on the tolerances of the resistance and nonlinearity of a current vs. voltage characteristic of adhesive joints.

Usability of Electrically Conductive Adhesives for Power Components Assembly

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Sensitivity of resistance of adhesive joints formed of frequently used electrically conductive adhesives with isotropic electrical conductivity to loading with short current pulses of high amplitude was examined. It was found that that the resistance increases with the increase of pulses amplitude and with the temperature at which experiments are carried out.

Comparison of 13 Modifications of Electrically Conductive Adhesive (ECA), Possible Ways to Create Silver Ions and Nanoparticles in ECA

  • Autoři: Ing. David Bušek, Ph.D., Pilarčíková, I., Ratislav, M., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings. Brno: VUT v Brně, FEI, 2009. pp. 251-255. ISBN 978-80-214-3933-7.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This work summarizes the result of experiments, where two basic adhesives AX20 and AX70MIN are either additionally filled with silver nanoparticles, carbon nanotubes or AgNO3, or modified using nitric acid (HNO3), chloride acid .

Design of Experiments of AlN Reactive Sputtering

  • Autoři: doc. Ing. Pavel Mach, CSc., Kolářová, J.
  • Publikace: 32nd ISSE 2009 Proceedings. Brno: VUT v Brně, FEI, 2009. ISBN 978-1-4244-4260-7.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Factor experiments have been used for optimization of a process of reactive sputtering of AlN. Different sputtering conditions were examined and their influence on the thickness of sputtered joints was investigated.

Electrically Conductive Adhesives - Study of Electrical and Mechanical Properties

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Basic characteristics of elekctrically conductive adhesives are presented. Dependence of the resistance of an adhesive joint on the temperature and dependence of nonlinearity on the temperature.

Electrically Conductive Adhesives Modified with AgNO3

  • Autoři: doc. Ing. Pavel Mach, CSc., Richter, L.
  • Publikace: 32nd ISSE 2009 Proceedings. Brno: VUT v Brně, FEI, 2009. ISBN 978-1-4244-4260-7.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical properties of electrically conductive adhesives have been improved using AgNO3. The function of AgNO3 is to create conductive particles during adhesive curring, which improve conductive net in adhesive.

Impedance of Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Kolář, J.
  • Publikace: 15th International Symposium for Design and Technology of Electronics Packages. Budapest: TU Budapest, 2009. pp. 80-81. ISBN 978-1-4244-5132-6.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Impedance of adhesive joints has been measured in the frequency range of 20 Hz to 1 MHz.

Influence of Carbon Nanotubes Added to a Commercial Adhesive

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives.

Mathematically Simulated Process of Evaporation of Thin NiCr Films

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 15th International Symposium for Design and Technology of Electronics Packages. Budapest: TU Budapest, 2009. pp. 106-107. ISBN 978-1-4244-5132-6.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Process of evaporation of NiCr thin films has been simulated using DOE. Experiments of the type two to two have been carried out and mathematical model has been tested using F-test.

Modifikovaná elektricky vodivá lepidla

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Diagnostika '09. Plzeň: Západočeská univerzita v Plzni, 2009. pp. 163-166. ISBN 978-80-7043-793-3.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Jsou popsány modifikace elektricky vodivých lepidel pro zlepšení jejich elektrických a mechanických vlastností mícháním před aplikací nebo dotací jiných částic.

Preparation of Electrically Conductive Adhesives Modified with AgNO3

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 32nd ISSE 2009 Proceedings. Brno: VUT v Brně, FEI, 2009. ISBN 978-1-4244-4260-7.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical properties of electrically conductive adhesives modified with AgNO3 have been investigated. Princip of the modification is in creating of silver nanoparticles fabricated by decomposition of AgNO3.

Risk Management of Implementation of Lead-free Soldering

  • Autoři: doc. Ing. Pavel Mach, CSc., Kotrčová, E.
  • Publikace: 15th International Symposium for Design and Technology of Electronics Packages. Budapest: TU Budapest, 2009. pp. 54-55. ISBN 978-1-4244-5132-6.
  • Rok: 2009

Self-aligement of Components Mounted Using Different Types of Solders

  • Autoři: doc. Ing. Pavel Mach, CSc., Kotrčová, E.
  • Publikace: 15th International Symposium for Design and Technology of Electronics Packages. Budapest: TU Budapest, 2009. pp. 78-79. ISBN 978-1-4244-5132-6.
  • Rok: 2009
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Difference between self-aligement of components mounted using lead and lead-free solders has been investigated.

The Ontology based FMEA of Lead Free Soldering Process

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Ontology rules have been used for design of a FMEA report of lead free soldering process. FMEA was directed on critical points from the point of view of joints failures and their repair.

Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 31st International Spring Seminar on Electronics Technology. New York: IEEE, 2008. p. 360-364. ISBN 978-1-4244-3973-7.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Two methods for evaluation of resistance of adhesive joints are presented. It is a method measuring of the resistance and measuring of nonlinearity of current vs. voltage characteristic.

Electrical Connection Network Within an Electrically Conductive Adhesive

  • DOI: 10.1109/ISSE.2008.5276536
  • Odkaz: https://doi.org/10.1109/ISSE.2008.5276536
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This article compares theoretical models with real measurement of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.

Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles

  • Autoři: doc. Ing. Pavel Mach, CSc., Radev, R., Pietriková, A.
  • Publikace: ESTC 2008. Greenwich, London: University of Greenwich, 2008. p. 1141-1146. ISBN 978-1-4244-2813-7.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical properties of adhesives filled with the mixture of silver micro and nano particles are investigated.

Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: 31st International Spring Seminar on Electronics Technology. New York: IEEE, 2008. pp. 400-404. ISBN 978-1-4244-3973-7.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper describes the use of Failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. Wettability of joined parts on the type of solder and surface finish of connected parts has been investigated.

Fillers Used in Electrically Conductive Adhesives - A Short Review of the State of the Art

  • Autoři: doc. Ing. Pavel Mach, CSc., Radev, R.
  • Publikace: SIITME 2008. Brasov: Transilvania University of Brasov, 2008. pp. 267-271. ISSN 1843-5122.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Fillers of electrically conductive adhesive are presented including their influence on adhesives properties

Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints

  • Autoři: Pietriková, A., doc. Ing. Pavel Mach, CSc., Ďurišin, J., Livovský, L., Urbančík, J.
  • Publikace: 31st International Spring Seminar on Electronics Technology. New York: IEEE, 2008. p. 365-368. ISBN 978-1-4244-3973-7.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The big advantage of the heat transfer in vapour phase soldering (VPS) is the extremely efficient transfer of latent heat through the condensing vapour and uniform temperature distribution.

Modification of Electrically Conductive Adhesives for Better

  • Autoři: doc. Ing. Pavel Mach, CSc., Richter, L., Pietriková, A.
  • Publikace: 31st International Spring Seminar on Electronics Technology. New York: IEEE, 2008. pp. 230-235. ISBN 978-1-4244-3973-7.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity. Improvement has been tested in dependence on stirring of adhesive and aditives.

Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Richter, L., Pietriková, A.
  • Publikace: ESTC 2008. Greenwich, London: University of Greenwich, 2008. pp. 305-308. ISBN 978-1-4244-2813-7.
  • Rok: 2008
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Technology of rotary and ultrasound mixing is tested for improvement of electrically properties of adhesives.

Theoretical and Experimental Background of Resistance and Nonlinearity Measurement of Adhesive Conductive Joints

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The paper is focused on theoretical description of electrical resistance of the adhesive joints and on nonlinearity of current versus voltage characteristic of the resistance.

Theory for Prediction of Electrical Contact Resistance of ACA Considering Electron Tunneling

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This paper describes few sample models for prediction of electrical contact resistance in ACA interconnects.

Acceptable Surface Finishes of Components for Isotropically Conductive Adhesive Assembly in Electronics

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Applied Electronics 2007. Plzeň: Západočeská univerzita v Plzni, 2007. pp. 41-44. ISBN 978-80-7043-537-3.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This work is focused on evaluation of influence of terminations surface finish of SMD components on electrical resistance and mechanical strength of the adhesive joints.

Adhesive Joints Formed of Electrically Conductive Adhesives with Isotropic and Anisotropic Electrical Conductivity

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: SIITME 2007. Baia Mare: North University of Baia Mare, 2007. pp. 160-164. ISSN 1843-5122. ISBN 978-973-713-188-1.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The electrical resistance and nonlinearity of the current voltage characteristic of the joints have been compared. Theory of nonlinearity has been presented.

Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Nanoparticle addition into commonly used ECAs improves resistance to mechanical straining but lowers resistance to moisture.

Comparison of Laser Trimming and Mechanical Trimming of Thick Films

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A., Konupka, T.
  • Publikace: Diagnostika '07. Plzeň: Západočeská univerzita v Plzni, 2007. pp. 255-258. ISBN 978-80-7043-557-1.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Basic properties of thick film resistor are the resistance, power and tolerance. Complementary parameters, which can play a significant role in some aplication, are noise and nonlinearity of a current vs. voltage characteristic.

Electrically Loaded Adhesive Bonds Formed on Different Surfaces

  • Autoři: doc. Ing. Pavel Mach, CSc., Radev, R.
  • Publikace: ISSE 2007. New York: IEEE Press, 2007. p. 367-371. ISBN 978-1-4244-1217-4.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Adhesive bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surface - Cu, immerse Au and Sn.

Evaluation and Selection Methods of Conductive Adhesives and Solder Materials

  • Autoři: Friese, M., doc. Ing. Pavel Mach, CSc., Bauer, R.
  • Publikace: ISSE 2007. New York: IEEE Press, 2007. pp. 214-215. ISBN 978-1-4244-1217-4.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Conductive adhesives and solder materials are used for assembly of electronic components. The selection of them has got a large number of valuation criteria. The use of new adhesive material and different solders depends on results of tests about their properties.

Impedance of Adhesive Joints over Frequency Range 0.3 to 3 GHz

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Impedance of adhesive joints is investigated over a frequency range of 300 to 3000 MHz.

Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc., Mlích, A.
  • Publikace: ISSE 2007. New York: IEEE Press, 2007. p. 134-138. ISBN 978-1-4244-1217-4.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    At present there are directions RoHS-WEEE which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production started.

Některé měřicí techniky pro diagnostiku elektricky vodivých lepidel

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Elektrotechnológia '07. Košice: TU Košice, FEI, 2007. pp. 130-135. ISBN 978-80-8073-834-1.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Jsou prezentovány metody pro měření odporu, šumu a nelinearity adhezních vodivých spojů. Nelinearita je měřena úrovní intermodulačních produktů vznikajících na adhezním spoji.

Nonlinearity of I-V Characteristic of Adhesive Joints Exposed to Climatic and Current Load

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: International Microelectronics and Packaging Society. Rzeszów: Rzeszów University of Technology, 2007. pp. 445-450. ISBN 978-83-917701-4-6.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Investigation of electrical quality of electrically conductive adhesive joints using measurement of their electrical resistance and nonlinearity. Changes sensitivity of parametrs under test was examined.

Quality Improvement in Electric Connection for Temperature Sensitive Devices Under Mechanical Stress

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Mechanical stress is is also very often presented for the completed device and therefore the quality and stability of such realized joint must be achieved.

Sensitivity of Resistance and Nonlinearity of Adhesive Joints to Their Climatic and Mechanical Load

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: Electronic Devices and Systems - IMAPS CS International Conference 2007. Brno: Vysoké učení technické v Brně, 2007. pp. 256-259. ISBN 978-80-214-3470-7.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Resistance and nonlinearity of the current vs. voltage characteristic of isotropicaly conductvie adhesives have been investigated. Changes of these parameters caused by mechanical load and climatic aging have been compared. The goal of the work has been to find which parameter is more sensitive to changes in adhesives.

Statistical Approach to Adhesive Conductive Joining Optimization

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 2007. Baia Mare: North University of Baia Mare, 2007. pp. 156-159. ISSN 1843-5122. ISBN 978-973-713-188-1.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Three basic statistical tools (histogram, Pareto chart and chart diagram) have been used for adhesive joining optimization.

Statistical Inspection of a Workplace for Adhesive Assembly

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: ISSE 2007. New York: IEEE Press, 2007. p. 30-33. ISBN 978-1-4244-1217-4.
  • Rok: 2007
  • DOI: 10.1109/ISSE.2007.4432816
  • Odkaz: https://doi.org/10.1109/ISSE.2007.4432816
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Quality of workplace for adhesive assembly has been examined using statistical inspection. The goal of the work has been to find our whether dispensing of adhesive makes forming of the joint with sufficient quality.

Utilization of Thermal Profile in Continuous Furnace for Curing Process of Isotropic Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A., Černek, P.
  • Publikace: SIITME 2007. Baia Mare: North University of Baia Mare, 2007. pp. 165-169. ISSN 1843-5122. ISBN 978-973-713-188-1.
  • Rok: 2007
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Continuous furnace has been used for creation of profile for curing of electrically conductive adhesives. It has been found that the temperature profile of an oven is sufficiently stabil for this activity.

Wetting Force Measurement of the Different Types of Solders and Testing Materials

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Wettability of diffeerent types of testing materials has been investigated using meniscograph. Measurement is focused on examination of surface tension of examined material and wettability of a sample under test.

Are Electrically Conductive Adhesives Suitable for Every Surface Finish?

  • Autoři: Ing. David Bušek, Ph.D., Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 2006 - International Symposium for Design and Technology of Electronic Packaging. Iasi: Technical University, 2006. pp. 14-17. ISBN 978-973-8961-23-4.
  • Rok: 2006
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical properties of adhesive joints created on different types of surfaces have been investigated. It has been found a strong dependence on the type of a surface

Changes of Properties of Adhesive Joints Causet by Temperature

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Changes of Properties of Ahesive Joints caused by their cyclic shock exposition at low temperature have been examined. Significal changes in dependence on the number of thermal shocks have been found.

Correlations among Mechanical and Electrical Properties of Conductive Adhesive Joints

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The purpose of this research is investigation of correlations between mechanical and electrical properties of ECAs.Especially between electrical resistance, nonlinearity and mechanical strength. Also dependence on high climatic load has been evaluated.

Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 29th International Spring Seminar on Electronics Technology. New York: IEEE, 2006. p. 88-92. ISBN 978-1-4244-0550-3.
  • Rok: 2006
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The purpose of this research is comparison of different analysis for investigation of quality of ECAs. Especially measurement of electrical resistance, current noise and nonlinearity.

Diagnostika vybraných elektrických vlastností ekologických spojovacích materiálů

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Jsou uvedeny techniky diagnostiky elektricky vodivých adhezních spojů. Z elektrických vlastností jsou sledovány odpor, nelinearita a šum.

Digital Archiving of Specific Scientific Information in the Czech Republic

Equipment for Measurement of Nonlinearity of Nominally Linear Components

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Nonlinearity of a nominally linear components is a significant parameter which informs about the difference of and investigated component from ideal one.Equipment is based on evaluation of intermodulation distortion.Experiment is focus on measurement of conductive adhesive joints.

Frequency Dependence of Impedance of Adhesive Joints

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives have in comparison with solders, significantily higher in-homogeneity of the structure and therefore electrical as well as mechanical properties of adhesive joints differ in comparison with that soldered ones. The joint impedances in the frequency range of 300 MHz to 3.4 GHz have been investigated.

Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc., Radev, R., Matějec, J.
  • Publikace: 1st Electronics Systenintegration Technology Conference. Piscataway: IEEE, 2006. p. 1323-1329. ISBN 1-4244-0552-1.
  • Rok: 2006
  • DOI: 10.1109/ESTC.2006.280182
  • Odkaz: https://doi.org/10.1109/ESTC.2006.280182
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Isotropic and anisotropic electrically conductive adhesives are alternative materials for substitution of common used tin-lead solders in electronic assembly. Their properties under strong current load has been investigated.

Modeling of Evaporation of Thin Films Using DOE

  • Autoři: doc. Ing. Pavel Mach, CSc., Kocián, M.
  • Publikace: 29th International Spring Seminar on Electronics Technology. New York: IEEE, 2006. pp. 223-227. ISBN 978-1-4244-0550-3.
  • Rok: 2006
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Technology of factorial experiments is used for simulation of evaporation of thin Ni films. Evaporated structures were examined from the point of view of the resistance and their thickness.

Properties of Electrically Conductive Adhesive Added with Ag Nanoparticles

  • Autoři: doc. Ing. Pavel Mach, CSc., Ing. David Bušek, Ph.D., Duraj, A.
  • Publikace: SIITME 2006 - International Symposium for Design and Technology of Electronic Packaging. Iasi: Technical University, 2006. pp. 63-67. ISBN 978-973-8961-23-4.
  • Rok: 2006
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Properties of electrically conductive adhesives completed by Ag nanoparticles such as nonlinearity, resistance and noise have been investigated.

Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Applied Electronics 2006. Plzeň: ZČU Plzeň, 2006. p. 35-38. ISBN 978-80-7043-442-0.
  • Rok: 2006

Study of Influence of Working Conditions on Changes of the Surface Tension of a Solders

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Two types of solders, SnPb and SAC, have been investigated from the point of view of a surface tension. Different conditions, such as the solder temperature, contents of oxygen and type of surface have been applied, wettability of the solder has been measured.

Transformation of Data for Statistical Processing

  • Autoři: doc. Ing. Pavel Mach, CSc., Thuring, J., Šámal, D.
  • Publikace: 29th International Spring Seminar on Electronics Technology. New York: IEEE, 2006. pp. 388-392. ISBN 978-1-4244-0550-3.
  • Rok: 2006
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Methods for data transformation toward to higher normality and their use are shown. Transformation are of the type Box-Wilson and of the type of parabolic one.

Adhesive Joining or Lead-Free Soldering?

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: Journal of Microelectronics, Electronic Components and Materials. 2005, 2005(4), 228-235. ISSN 0352-9045.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive joining and lead free soldering are compared and properties of jointts are evaluated.

Experiment of Influence Curing Pressure of Anisotropically Conductive Adhesives on Parameters of Joints

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: XXIV International Conference of International Microelectronics and Packaging Society - Poland Chapter. Szczecin: Wydawnictwo Uczelniane Politechniki Szczecinskiej, 2005. pp. 91-94. ISBN 83-917701-2-5.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The purpose of this research is investigation of basic electrical and mechanical properties of joint realized with ACA´s.Especially influence of curinf pressure on these parameters.

Influence of Accelerated Ageing on Mechanical Parameters of Soldered and Adhesive Joints

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: POSTER 2005. Praha: České vysoké učení technické v Praze, Fakulta elektrotechnická, 2005.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Quality of soldered and adhesive joints is evaluated according to their electrical and mechanical properties. The paper is focused on examination of resistance of the joints against the mechanical load. Two types of mechanical properties have been investigated: the tensile strength and the shear strength.

Influence of Interconnection Surface Finishes on Quality of Adhesive Joints

  • DOI: 10.1109/ISSE.2005.1491050
  • Odkaz: https://doi.org/10.1109/ISSE.2005.1491050
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesives electrically connect and mechanically bond connected parts. Influence of types of surface finishes on quality of adhesive bonds has been Influence of types of surface finishes on quality of adhesive bonds has been examined.

Metody a standardy pro přejímání dokumentů v digitální podobě v dánských archivech

  • Autoři: doc. Ing. Pavel Mach, CSc., Macek, O., Wanner, M.
  • Publikace: Archivní časopis. 2005, 55(Zvl. př. 1), 3-48. ISSN 0004-0398.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Jsou uvedeny a vzájemně porovnány metody a normy archivování elektronických dokumentů v dánských archivech.

Porovnání diagnostických nástrojů pro hodnocení adhezních spojů

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: Diagnostika '05. Plzeň: Západočeská univerzita v Plzni, 2005. pp. 161-164. ISBN 80-7043-368-X.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    V elektrotechnickém průmyslu je se stále větším důrazem dbáno na ekologičnost výroby a výrobků. Proto jsou olovnaté pájky nahrazovány pájkami bezolovnatými.

Processing of Alumina Nano-films

  • Autoři: doc. Ing. Pavel Mach, CSc., Rozkošný, T.
  • Publikace: ISSE 2005 Proceeding. New York: IEEE Computer Society Press, 2005. pp. 1-5. ISBN 0-7803-9324-4.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    There are different technologies for processing of alumina thin films. The films were prepared by the use of reactive sputtering in oxygen plasma on glass substrates.

Properties of Joint Made Using Electrically Conductive Adhesives

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This article deals with the substrate quality influence on the electrical properties of joints prepared using electrically conductive adhesives. Significant dependence on surface quality was found.

Shear and Tensile Strength of Isotropic Electrically Conductive Adhesives

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Applied Electronics 2005 - International Conference Pilsen. Plzeň: Západočeská universita, 2005. pp. 93-96. ISBN 80-7043-369-8.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The goal of this work is investigation of basic mechanical properties (shear strength and tensile strength) of joints realized by Electrically Conductive Adhesives with isotropic conductivity and comparison with strength of common used Sn-Pb and Lead-free solders.

Stability of Adhesive Joints Created on Pads with Different Types of Surface Finishes

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Stability of Adhesive Joints Created on Pads with Different Types of Surface Finishes was examined. It was found that highest stability is on gold surfaces.

Statistically Simulated Voltage Distribution of the Serial Connected Diodes in Stack

  • Autoři: Šámal, D., doc. Ing. Pavel Mach, CSc., Sopko, V.
  • Publikace: International Symposium for Design and Technology of Electronic Packaging. Cluj-Napoca: Technical University, 2005. pp. 14-19. ISBN 973-713-063-4.
  • Rok: 2005
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Life-time of a column of diode chips joined in serie is influenced by properties of diode chips segnificantly. These stacked diodes a packaded in ceramic cyllinders, and therefore it is not possible to measured parameters on individual chips. Therefore these parameters were simulated using Poisson distribution.

Study of Expenses Jointed with Long Term Preservation of Digital Documents

  • Pracoviště: Katedra elektrotechnologie, Katedra počítačů
  • Anotace:
    Influence of long-time archiving of digital documents were examined with respect to their readibility. Expences joined with idividual types of archiving of these documents were analysed including problems joined with archiving. Possible solution were investigated.

Vliv materiálu kontaktních plošek DPS na mechanické vlastnosti lepených a pájených spojů

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Cílem této práce je měření a vyhodnocování základních mechanických parametrů spojů (pevnost ve střihu a pevnost v odtrhu), realizovaných elektricky vodivými lepidly s izotropní vodivostí.

Diagnostics of Adhesive Bonds

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A., Bušek, D., Ješ, J., Orth, T.
  • Publikace: 3rd European Microelectronic and Packaging Symposium with Table Top Exhibition. Brno: VUT v Brně, FEI, 2004. pp. 83-88. ISBN 80-239-2835-X.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrically conductive adhesive bonds are increasingly used as an environmentally acceptable substitution of soldered bonds realized by the use of Sn-Pb solders.

Digital archiving of scientific information: Czech experience

Electrically Conductive Adhesives Versus Lead-Free Solders

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A., Vávra, R.
  • Publikace: 3rd European Microelectronic and Packaging Symposium with Table Top Exhibition. Brno: VUT v Brně, FEI, 2004. pp. 541-546. ISBN 80-239-2835-X.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Many types of solders are mostly used for conductive joining in electronics assembly. Comparison of some of them was carried out from the point of view of electrical properties.

Electrically Conductive Adhesives Versus Lead-Free Solders

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: POSTER 2004. Praha: ČVUT v Praze, FEL, 2004. ISBN 0-8194-5950-X.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Comparison of electrical parameters of different types of electrically conductive adhesives with solders. Compared were the joint resistance and nonlinearity of the current vs. voltage characteristic.

Fabrication of Al2O3 and AlN Thin Films by Reactive Sputtering and Optimization Using DOE

  • Autoři: doc. Ing. Pavel Mach, CSc., Kolářová, J.
  • Publikace: 27th International Spring Seminar on Electronics Technology. New York: IEEE, 2004. p. 304-308. ISBN 0-7803-8422-9.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Fabrication of thin films of Al2O3 and AlN has been carried out by reactive sputtering. Optimization of a process has been carried out by the use of factorial experiments.

Fabrication of Thin Al2O3 Films by Magnetron Sputtering

  • Autoři: doc. Ing. Pavel Mach, CSc., Klesse, T.
  • Publikace: IMAPS Poland Proceedings. Wroclaw: Technical University, 2004. pp. 293-296. ISBN 83-917701-1-7.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The 99.99 Al2O3 target has been sputtered in Ar, the frequency of the generator has been 13.56 MHz. The pressure has been 4 Pa. Thickness of the films was in tenths of microns.

Influence of Trimming of Resistive Thick Films on Nonlinearity of Their Current vs. Voltage Characteristics

  • Autoři: doc. Ing. Pavel Mach, CSc., Svasta, P.
  • Publikace: 27th International Spring Seminar on Electronics Technology. New York: IEEE, 2004. p. 309-312. ISBN 0-7803-8422-9.
  • Rok: 2004

Long-Time Preservation of Digital Documents: Basic Characteristic and Problems

Quality of Joints Realized by Electrically Conductive Adhesives and Lead-free Solders

  • Autoři: Duraj, A., doc. Ing. Pavel Mach, CSc.,
  • Publikace: The 11th Electronic Devices and Systems Conference. Brno: VUT v Brně, 2004. pp. 385-389. ISBN 80-214-2701-9.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Electrical and mechanical parameters of soldered and adhesive joints were examined. More types of adhesives and lead free solders were tested and results were compared.

Standardization in Digital Archiving

Tensile Strength and Shear Strength of Soldered and Adhesive Joints after Thermal and Humidity Aging

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: SIITME 2004. Bucharest: Politehnica, 2004. pp. 149-152. ISBN 973-9463-83-5.
  • Rok: 2004
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Quality of soldered and adhesive joints is evaluated according to their electrical and mechanical properties. It is found that it is no correlation among these properties.

Testing of Normality of Data Files for Application of SPC Tools

  • Autoři: doc. Ing. Pavel Mach, CSc., Hochlová, H.
  • Publikace: 27th International Spring Seminar on Electronics Technology. New York: IEEE, 2004. p. 318-321. ISBN 0-7803-8422-9.
  • Rok: 2004

Degradation of Adhesive Bonds with Short Current Pulses

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 microsec. and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A.

Kvalita spojů realizovaných elektricky vodivými lepidly při různých typech namáhání

  • Autoři: doc. Ing. Pavel Mach, CSc., Ješ, J., Orth, T.
  • Publikace: Diagnostika 03. Plzeň: ZČU FE, Odd. elektrotechnologie katedry el. strojů, 2003. pp. 233-236. ISBN 80-7082-952-4.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Kvalita spojů realizovaných elektricky vodivými lepidly byla zkoumána při různých typech namáhání. Bylo zjištěno že lepidla jsou nejvíce citlivá na vlhkostní namáhání.

New Types of Chart Diagrams for Control of Quality of Manufacturing Processes

  • Autoři: Guáqueta, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Applied Electronics. Plzeň: ZČU Plzeň, 2003. pp. 75-78. ISBN 80-7082-951-6.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Different types of tools are used for control of quality of manufacturing processes. The most used are "Seven Ishikawa", however, many others are used as well. A very significant tool is a chart diagram. There are some basis types of these diagrams used for variables and attributes. The diagram mostly used for variables are of the types fi,s or fi,R, where fi is a mean value of measured variable, s is standard deviation and R is variability (dispersion). These control charts describe single characteristics of a process, without relationship to other characteristics. New types of charts described in this paper are focused on investigation of rations between two statistical characteristics of the measured files. Information contens of these chart diagrams are quite different in comparison with the contens of the standard ones.

Normalized Chart Diagrams and Their Use in Practical Applications

  • Autoři: Guáqueta, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: 26th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2003. p. 417-422. ISBN 0-7803-8002-9.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Statistical control is important because it shows you what the process is capable of producting over time. It is useful to make predictions about how the process will be in the future, based in how was in the past.

Properties of Adhesive Bonds Exposed to the Static and Dynamic Mechanical Load

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 26th International Spring Seminar on Electronics Technology. Košice: Technical University of Košice, 2003. p. 412-416. ISBN 0-7803-8002-9.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Two types of mechanical load have been applied static load and dynamic one. The load has been induced by a definite deflection of PCB after mounting of the resistots with zero resistance by the use of electrically conductive adhesives.

Properties of Tunneling Junctions for Inelastics Electron Tunneling Spectroscopy

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Nanosciences, Nanotechnologies and Nanomaterials. Brno: VUT v Brně, Fakulta strojní, 2003. pp. 81-86. ISBN 80-214-2527-X.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Inelastic electron tunneling spectroscopy (IETS) is based on a fact that electron tunneling in metal-insulator-metal junctions can excite the vibrational modes of molecules in or near the insulating barrier region.

Smoothing and Transformation Methods Usable in Statistical Production Control and Their Efficiency

  • Autoři: doc. Ing. Pavel Mach, CSc., Guáqueta, J.
  • Publikace: SIITME 2003. Timisoara: University Politehnica Timisoara, 2003. pp. 89-95. ISBN 973-96592-6-8.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Data files obtained from real production are not always normally distributed. Their non-normality causes that the use of statistical production tools for control of quality of production give false results.

Testing of Use of Zhigalski Theory for Description of Nonlineatity of Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 2003. Timisoara: University Politehnica Timisoara, 2003. pp. 16-19. ISBN 973-96592-6-8.
  • Rok: 2003
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    The electronics packaging is moving toward to envitonmental materials. Therefore electrically conductive adhesives (ECA) substitute Sn-Pb solders.

Applicability of Flow Charts and Ishikawa Diagram into the Taguchi Methods Steps (Robust Parameter Design)

  • Autoři: Guáqueta, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 02 - 8th International Symposium for Design and Technology of Electronic Modules. Bucharest: Politehnica, 2002, pp. 99-104. ISBN 973-9357-13-X.
  • Rok: 2002
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Je analyzována účinnost použití základních nástrojů pro statistické řízení jakosti pro Taguchiho metody. Je analyzováno použití regulačních diagramů a Ishikawových diagramů a účinnost tohoto využití

Archivování dat a digitální archiv

Electrically Conductive Adhesives as Substitution of Solders in Electronics

  • Autoři: doc. Ing. Pavel Mach, CSc., Vávra, R., Duroj, A.
  • Publikace: Proceedings of Workshop 2002. Praha: České vysoké učení technické v Praze, 2002. pp. 762-763. ISBN 80-01-02511-X.
  • Rok: 2002

Experiments with Real Production Processes Data to Analyze Smoothing by Mens of Grouping

  • Autoři: Guáqueta, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: ISSE 2002. Praha: ČVUT FEL, Katedra elektrotechnologie, 2002. pp. 342-345. ISBN 0-7803-9824-6.
  • Rok: 2002

Influence of Normality of Measured Data on Results of Statistical Quality Control

  • Autoři: doc. Ing. Pavel Mach, CSc., Guáqueta, J.
  • Publikace: ISSE 2002. Praha: ČVUT FEL, Katedra elektrotechnologie, 2002. pp. 346-349. ISBN 0-7803-9824-6.
  • Rok: 2002

Properties of Electrically conductive adhesive joints under mechanical load

  • Autoři: doc. Ing. Pavel Mach, CSc., Krejzlík, V.
  • Publikace: SIITME 02 - 8th International Symposium for Design and Technology of Electronic Modules. Bucharest: Politehnica, 2002. pp. 5-9. ISBN 973-9357-13-X.
  • Rok: 2002
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Byly vyrobeny vzorky vodivých spojů ze 6 druhů elektricky vodivých lepidel. Spoje byly mechanicky zatíženy a byly sledovány změny odporu, nelinearity a šumu spojů. Bylo zjištěno, že mikrothlinky, které se vytvoří ve spojích mechanickým namáháním významně změní uvedené parametry.

Quality of Adhezive Joints, Joints Realized by Lead Free Solders and Sn-Pb Solder During Accelerated Stress Test

  • Autoři: Vávra, R., doc. Ing. Pavel Mach, CSc.,
  • Publikace: ISSE 2002. Praha: ČVUT FEL, Katedra elektrotechnologie, 2002. pp. 334-341. ISBN 0-7803-9824-6.
  • Rok: 2002

Strukturované studium na Fakultě elektrotechnické Českého vysokého učení technického v Praze

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Nové trendy vo vzdelávaní. Žilina: Žilinská universita, Elektrotechnická fakulta, 2002. p. 13-16.
  • Rok: 2002
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Na Fakultě elektrotechnické ČVUT v Praze byla zcela změněna struktura studijních plánů a předpisů tak, aby nové studijní plány byly v souladu s Boloňskou deklarací. Nově vypracované strukturované studijní plány budou pro první ročník studentů bakalářského a magisterského studia otevřeny od akademického roku 2003/2004. Strukturované studijní plány jsou nabízeny v presenční i kombinované formě při zachování stejných studijních plánů.

Technologie elektronických obvodů a systémů

  • Autoři: Szendiuch, I., doc. Ing. Pavel Mach, CSc., Klabačka, E.
  • Publikace: Brno: VUTIUM Press, 2002. ISBN 80-214-2072-3.
  • Rok: 2002
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Kniha je zaměřena na moderní výrobní procesy v elektronické montáži včetně otázek řizení kvality a ekologických otázek

Analýza využitelnosti bezolovnatých pájek a elektricky vodivých lepidel

  • Autoři: doc. Ing. Pavel Mach, CSc., Duraj, A.
  • Publikace: Diagnostika '01. Plzeň: Západočeská universita, 2001. pp. 254-259. ISBN 80-7082-742-4.
  • Rok: 2001

DC and AC Electrical Properties and Long-term Stability of LTCC Resistors

  • Autoři: Dziedzic, A., Golonka, L., Kolek, A., doc. Ing. Pavel Mach, CSc., Nitsch, K.
  • Publikace: ISSE2001. Bucharest: Politehnica, 2001. p. 137-141. ISBN 0-7803-7111-9.
  • Rok: 2001

Failures of Soldered and Adhesive Joints - A Comparasion

  • Autoři: doc. Ing. Pavel Mach, CSc., Guáqueta, J.
  • Publikace: Applied Electronics 2001. Plzeň: Západočeská universita, 2001. pp. 162-165. ISBN 80-7082-758-0.
  • Rok: 2001

Nonlinearity Measurement of Thin Metal Films

  • Autoři: Vávra, R., doc. Ing. Pavel Mach, CSc.,
  • Publikace: ISSE2001. Bucharest: Politehnica, 2001. p. 202-206. ISBN 0-7803-7111-9.
  • Rok: 2001

Pajky bez olova - současný stav

  • Autoři: doc. Ing. Pavel Mach, CSc., Urbánek, J.
  • Publikace: SMT-info 2001. Brno: SMT Info, 2001. pp. 9-12. ISSN 1211-6947.
  • Rok: 2001

Pájky bez olova - současný stav

  • Autoři: doc. Ing. Pavel Mach, CSc., Urbánek, J.
  • Publikace: SMT-info 2001. Brno: SMT Info, 2001. pp. 9-12. ISSN 1211-6947.
  • Rok: 2001

Process Capability - Ways of Its Expression and Their Discussion

  • Autoři: doc. Ing. Pavel Mach, CSc., Guáqueta, J.
  • Publikace: SIITME 2001. Bucharest: Politehnica, 2001. pp. 7. ISBN 973-0-02385-9.
  • Rok: 2001

Relationships among Properties of Sputtered Thin Films and Sputttering Process Parameters

  • Autoři: Kolář, M., doc. Ing. Pavel Mach, CSc.,
  • Publikace: ISSE2001. Bucharest: Politehnica, 2001. p. 42-46. ISBN 0-7803-7111-9.
  • Rok: 2001

The Use of Combined Tools for Statistical Analysis of a Technological Process

  • Autoři: Guáqueta, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 2001. Bucharest: Politehnica, 2001, pp. 34. ISBN 973-0-02385-9.
  • Rok: 2001
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Je ukázáno využití kombinovaných nástrojů řízení jakosti pro rozbor technologického procesu

The Use of Control Charts and Factorial Experiments for Improvement of Quality of Production Process

  • Autoři: Guáqueta, J., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Applied Electronics 2001. Plzeň: Západočeská universita, 2001. pp. 77-82. ISBN 80-7082-758-0.
  • Rok: 2001

Utilization of the Seven Ishikawa Tools (Old Tools) in the Six Sigma Strategy

  • Autoři: doc. Ing. Pavel Mach, CSc., Guáqueta, J.
  • Publikace: ISSE2001. Bucharest: Politehnica, 2001. p. 51-55. ISBN 0-7803-7111-9.
  • Rok: 2001

Advanced Thick Film Materials for High Density Metallization

Characterization of Materials

  • Autoři: Vratislav, S., Nedbal, I., Král, J., Steidl, J., Bouda, V., doc. Ing. Pavel Mach, CSc., Kratochvíl, J.
  • Publikace: Proceedings of Workshop 2000. Praha: České vysoké učení technické v Praze, 2000, pp. 234. ISBN 80-01-02229-3.
  • Rok: 2000

Characterization of Materials

  • Autoři: Vratislav, V., Nedbal, I., Král, J., Steidl, J., Bouda, V., doc. Ing. Pavel Mach, CSc., Kratochvíl, J.
  • Publikace: Proceedings of Workshop 2000. Praha: České vysoké učení technické v Praze, 2000. pp. 234. ISBN 80-01-02229-3.
  • Rok: 2000

Characterization of Materials

  • Autoři: Vratislav, S., Nedbal, I., Král, J., Steidl, J., Bouda, V., doc. Ing. Pavel Mach, CSc., Kratochvíl, J.
  • Publikace: Proceedings of Workshop 2000. Praha: České vysoké učení technické v Praze, 2000. pp. 234. ISBN 80-01-02229-3.
  • Rok: 2000

Diagnostic of Thick Film Lines for Microwave Applications

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: ISSE 2000 Conference Proceeding. Budapest: Technical University, 2000. pp. 355-358. ISBN 963-420-639-5.
  • Rok: 2000

Diagnostics and Aging of Electrically Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Škvor, M., Száraz, P.
  • Publikace: 22nd International Conference on Microelectronics. Niš: IEEE Electron Devices Society, 2000. p. 517-520. ISBN 0-7803-5235-1.
  • Rok: 2000

Diagnostics of Nonlinearity of Current VS Voltage Characteristics - Theory and Applications

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: MIDEM. Ljubljana: Electrotechnical Society of Slovenia, 2000. p. 15-20. ISBN 961-90001-8-8.
  • Rok: 2000

Influence of Surface on Quality of Conductive Adhesive Joints

Materiály pro elektrotechniku na přelomu tisíciletí

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: ELEKTRO 2000. Praha: FCC Public, 2000. p. 258-297. ISBN 80-901985-7-0.
  • Rok: 2000

Perspektivy pouzdření v elektronice a mikroelektronice

Porovnání a budoucnost bezolovnatých pájek a elektricky vodivých lepidel

Properties and Limits of Material Systems for High-Density Metallization

Properties of Electrical Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Škvor, M., Vávra, R.
  • Publikace: Proceedings of Workshop 2000. Praha: České vysoké učení technické v Praze, 2000. pp. 260. ISBN 80-01-02229-3.
  • Rok: 2000

Properties of Electrical Lines with Low Width Made of Conductive Pastes

Adavanced Thick Film Materials for Manufacturing of High Density Microwave Circuits

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: ELEKTRO 99. Žilina: Žilinská univerzita, 1999. pp. 55-57. ISBN 80-7100-605-X.
  • Rok: 1999

Advanced Thick Film Material Systems

  • Autoři: doc. Ing. Pavel Mach, CSc., Urbánek, J., Heřmanský, V.
  • Publikace: Transaction on the Precision and Electronic Technology. Warsaw: Technical University, 1999. pp. 97-101. ISBN 83-904975-2-2.
  • Rok: 1999

Conductive Joining in Contemporary Electronics Problems and Solutions

  • Autoři: doc. Ing. Pavel Mach, CSc., Urbánek, J.
  • Publikace: Microelectronic Technologies and Microsystems. Košice: TU Košice, 1999. pp. 20-21.
  • Rok: 1999

Evaluation of Electrically Conductive Adhesives Quality by Measurement of Noise and Nonlinearity of Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Škvor, M.
  • Publikace: Proceedings of Workshop 99. Praha: České vysoké učení technické v Praze, 1999, pp. 225.
  • Rok: 1999
  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    Hodnoceni kvality elektricky vodivych lepidel merenim sumu a nelinearity lepenych spoju

Hodnocení lepidel pro montáž v elektrotechnice

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Diagnostika 99. Plzeň: ZČU FE, Odd. elektrotechnologie katedry el. strojů, 1999. pp. 207-211. ISBN 80-7082-544-8.
  • Rok: 1999

Influence of Surface on Quality of Conductive Adhesive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: First International Conference on Advanced Engineering Design - Proceedings. Praha: České vysoké učení technické v Praze, 1999. pp. 52-53. ISBN 80-01-02055-X.
  • Rok: 1999

Křižiště a tlustovrstvé pokovení o vysoké rozlišovací schopnosti

  • Autoři: doc. Ing. Pavel Mach, CSc., Heřmanský, V.
  • Publikace: Bulletin anotací. Brno: SMT Info, 1999. pp. 8-9. ISSN 1211-6947.
  • Rok: 1999

Některé aspekty hodnocení spolehlivosti mikroelektronických součástek

Properties of Electically Conductive Adhesive Joints in Wide Frequency Range

Properties of Joints Realized by Electrically Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc., Škvor, M.
  • Publikace: Conference Proceedings. Bristol: Institute of Physics Publishing, 1999. pp. 284-289. ISBN 0-9535858-0-8.
  • Rok: 1999

Quality of Electrically Conductive Adhezive Joints

  • Autoři: doc. Ing. Pavel Mach, CSc., Škvor, M., prof. Ing. Václav Papež, CSc.,
  • Publikace: 22nd International Spring Seminar on Electronics Technology 1999. Dresden: Electronics Technology Laboratory of the Dresden University of Technology, 1999. pp. 1-5. ISBN 3-934142-00-1.
  • Rok: 1999

Vědecké aktivity na katedře elektrotechnologie FEL ČVUT v Praze

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Elektrotechnologie 99. Brno: VUT v Brně, FEI, 1999. pp. 54-55. ISBN 80-214-1358-1.
  • Rok: 1999

Vztah mezi odporem a nelinearitou elektricky vodivých lepených spojů

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Aplikovaná elektronika 99. Plzeň: Západočeská universita, 1999. pp. 96-99. ISBN 80-7082-512-X.
  • Rok: 1999

Zkušenosti s elektricky vodivými lepidly a jejich perspektiva

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Materiály pro elektroniku a elektrotechniku. Ostrava: Tanger, 1999. pp. 26-29. ISBN 80-85988-29-1.
  • Rok: 1999

Correlation Among Differential Nonlinearity, Nonlinearity and Noise of Thick Film Resistors

  • Autoři: doc. Ing. Pavel Mach, CSc., Svasta, P.
  • Publikace: ISSE 98. Wien: Technische Universität, 1998. pp. 73-76. ISBN 3-85465-004-3.
  • Rok: 1998

Doplněk k popisu elektrické vodivosti materiálů pro tlustovrstvé odpory

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: DIDMATECH 98. Olomouc: Univerzita Palackého, 1998. pp. 93-94. ISBN 80-7067-868-2.
  • Rok: 1998

Influence of Trimming of Thick Film Resistors on Their Parameters

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Applied Electronics 98. Plzeň: Západočeská universita, 1998. pp. 111-114. ISBN 80-7082-443-3.
  • Rok: 1998

Microelectronic Interconnections and Assembly

  • Autoři: Harman, G., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Dordrecht: Kluwer Academic Publishers, 1998. ISBN 0-7923-5139-8.
  • Rok: 1998

Několik poznámek k vodivosti tenkých vrstev

Noise and Nonlinearity Measurments - Equipment and Problems

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 98. Bucharest: Politehnica, 1998. pp. 31-38. ISBN 973-0-00692-X.
  • Rok: 1998

Noise and Nonlinearity of Thick Film Resistors Made of Different Types of Pastes

  • Autoři: doc. Ing. Pavel Mach, CSc., Dziedzic, A., Pelikanova, I.
  • Publikace: Workshop 98. Praha: České vysoké učení technické v Praze, 1998, pp. 479-480.
  • Rok: 1998

Nové materiály pro vodivé propojování a jejich vlastnosti

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: DIDMATECH 98. Olomouc: Univerzita Palackého, 1998. pp. 89-92. ISBN 80-7067-868-2.
  • Rok: 1998

Properties and Fabrication of Substrates for MCM-L Technology

Properties of Electrically Conductive Adhesives

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 20th International Spring Seminar. Sofia: TU Sofia, 1998. pp. 100-104. ISSN 0861-0797.
  • Rok: 1998

SPC and Its Use for Control of Manufactoring of Electrical Machines

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Dielectric and Insulating Systems in Electrical Engineering. Bratislava: STU v Bratislave, 1998. pp. 84-87. ISBN 80-227-1017-2.
  • Rok: 1998

Two Methods for Assessment of Quality of Passive Electronic Components

Voltage Nonlinearity of Carbon Black/Polyesterimide Thinck Resistive Films

  • Pracoviště: Katedra elektrotechnologie
  • Anotace:
    This paper deals with current-voltage characteristics of carbon black/polyesterimide thick-film resistors. The weak nonlinearity was measured by two different methods-"classical", where distortion of sinusoidal current was determined by amplitude of a third harmonics voltage and "pulse" one, i.e. current measurements during logarithmic voltage pulses affected test samples. The in fluence of active phase kind thigh or medium structure carbon black) and contents as well as curing temperature is discussed. The correlation between voltage nonlinearity and 1/f noise is analysed. (C) 1998 Elsevier Science Ltd. All rights reserved.

Výuka v oboru "Technologické systémy" na ČVUT FEL

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Elektrotechnologie 98. Plzeň: Západočeská universita, 1998. pp. 82-83. ISBN 80-7082-433-6.
  • Rok: 1998

Adheze a povrchová struktura organických vrstev

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Materiály a výrobné procesy v elektrotechnike. Bratislava: STU v Bratislave, 1997. pp. 65-68. ISBN 80-227-0991-3.
  • Rok: 1997

Agein of Thick Film Resistors

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Materiály a výrobné procesy v elektrotechnike. Bratislava: STU v Bratislave, 1997. pp. 60-65. ISBN 80-227-0991-3.
  • Rok: 1997

Basic Properties of Films of Electric Insulating Varnishes

  • Autoři: doc. Ing. Pavel Mach, CSc., Petr, J., Kuba, J.
  • Publikace: Diagnostika '97. Plzeň: Západočeská universita, 1997, pp. 301-305. ISBN 80-7082-342-9.
  • Rok: 1997

Changes of Properties of Electric Insulating Varnishes during Ageing

  • Autoři: doc. Ing. Pavel Mach, CSc., Mrázek, Z.
  • Publikace: Workshop 97. Praha: České vysoké učení technické v Praze, 1997. pp. 909-910.
  • Rok: 1997

Compararsion of Adhesive and Solder Joints

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Transactions on the Prediction and Electronic Technology. Warsaw University of Technology, 1997. pp. 119-122. ISBN 83-904975-1-4.
  • Rok: 1997

Holographic and Thermal Diagnostic of Integrated Circuits

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Multichip Modules with Integrated Sensors. Dordrecht: Kluwer Academic Publishers, 1997. p. 27-34. ISBN 0-7923-4194-5.
  • Rok: 1997

Instrumentace pro hodnocení nelinearity VA charakteristik

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Aplikovaná elektronika 97. Plzeň: Západočeská universita, 1997. pp. 113-118. ISBN 80-7082-337-2.
  • Rok: 1997

Is It Possible to Use Electric Characteristics of Polymer Films for Prediction of Characteristic of Other Type?

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Education and Research in Microelectronics. Wroclaw: Technical University, 1997. pp. 181-185. ISBN 83-905990-5-8.
  • Rok: 1997

Methodology of Evaluation of Conductive and Resistive Films for Electronics after LCA

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: SIITME 97. Bucharest: Politehnica, 1997. pp. 33-36. ISBN 973-0-00508-7.
  • Rok: 1997

Multičipové moduly - současný stav a perspektivy

Optimalizace výběru parametrů pro hodnocení stárnutí vrstev elektroizolačních laků

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Plasty v elektrotechnice, elektronice a v příbuzných oborech. Praha: Svaz zpracovatelů plastů ČR, 1997. pp. 19-22.
  • Rok: 1997

Quo Vadis Microelectronics

  • Autoři: Ryšánek, V., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Education and Research in Microelectronics. Wroclaw: Technical University, 1997. pp. 88-90. ISBN 83-905990-5-8.
  • Rok: 1997

The Use of Nonlinearity Measurements for the Reliability Assessment

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Electronic Packagin for High Reliability. Reston: International Microelectronics and Packagin Society, 1997. pp. 17-24.
  • Rok: 1997

Adhesion Study by Scratch Test and Vibrational Spectroscopy

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Workshop 96. Praha: České vysoké učení technické v Praze, 1996, pp. 583-584.
  • Rok: 1996

Automatic Measurement of Inelasting Electron Tunneling Spectra

  • Autoři: doc. Ing. Pavel Mach, CSc., Kubečka, M., Kuška, M.
  • Publikace: Workshop 96. Praha: České vysoké učení technické v Praze, 1996, pp. 743-744.
  • Rok: 1996

Changes in Education of Electrical Engineers in the Czech Republic

  • Autoři: Ryšánek, V., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Proceedings of the 19th International Spring Seminar on Electronics Technology ISSE 96. Budapest: Technical University, 1996. pp. 38-42. ISBN 963-420-505-4.
  • Rok: 1996

Contact Nonlinearity between Thick Film Interconnection and Resistive Film

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: ISHM/NATO Advanced Research Workshop Exhibition: Microelectronic Interconnections and Microassembly. Reston: ISHM, 1996, pp. 40-41.
  • Rok: 1996

IR Spectroscopy and Adhesion Measurement - Tools for Diagnostics of Electric Insulating Varnish Quality

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Proceedings of the 19th International Spring Seminar on Electronics Technology ISSE 96. Budapest: Technical University, 1996, pp. 217-220. ISBN 963-420-505-4.
  • Rok: 1996

Nonlinearity between Metal Contact and HTS Layer

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Proceedings of the 19th International Spring Seminar on Electronics Technology ISSE 96. Budapest: Technical University, 1996, pp. 79-84. ISBN 963-420-505-4.
  • Rok: 1996

Adhezion of Electric Insulating Varnish

  • Autoři: Schorníková, M., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Proceeding of ISSE 95. Praha: České vysoké učení technické v Praze, Fakulta elektrotechnická, 1995, pp. 96-100.
  • Rok: 1995

Correlation between Adhesion and Electrical Qualities of Electric Insulating Varnish

  • Autoři: Mrázek, Z., doc. Ing. Pavel Mach, CSc.,
  • Publikace: Proceeding of ISSE 95. Praha: České vysoké učení technické v Praze, Fakulta elektrotechnická, 1995, pp. 108-112.
  • Rok: 1995

Equipment for Diagnostics of the Contacts Quality

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Workshop 95. Praha: České vysoké učení technické v Praze, 1995, pp. 487-488.
  • Rok: 1995

Jsou nosiče typu CD věčné?

  • Autoři: doc. Ing. Pavel Mach, CSc., Kudláček, I., Šnorek, M.
  • Publikace: Elektronika. 1995, 45(2), 18-24. ISSN 0862-4607.
  • Rok: 1995

Laserová technologie

Measurement of thin Varnish Layers by the Use of Tunnelling Spectroscopy

  • Autoři: doc. Ing. Pavel Mach, CSc., Kuška, M., Kubečka, M.
  • Publikace: Workshop 95. Praha: České vysoké učení technické v Praze, 1995, pp. 433-434.
  • Rok: 1995

Methodology of Electric Insulating Varnishes Testing

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Workshop 95. Praha: České vysoké učení technické v Praze, 1995, pp. 489-490.
  • Rok: 1995

Methods of Complex Mathematical Diagnostics of Electric Insulating Varnish

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Proceeding of ISSE 95. Praha: České vysoké učení technické v Praze, Fakulta elektrotechnická, 1995, pp. 54-59.
  • Rok: 1995

Metodika komplexního hodnocení elektroizolačního laku pro elektroniku

Metodika sledování vzájemných souvislostí mezi el. vlastnostmi elektroizolačních laků

Metodika volby elektroizolačního laku při konstrukci elektrotechnického zařízení

Počítačová záznamová media

  • Autoři: doc. Ing. Pavel Mach, CSc., Kudláček, I., Šnorek, M.
  • Publikace: Archivní časopis. 1995, 45 1-28. ISSN 0004-0398.
  • Rok: 1995

Quantitative Analysis of Tunnelling Spectra

Souvislost mezi elektrickými a neelektrickými vlastnostmi elektroizolačního laku

  • Autoři: doc. Ing. Pavel Mach, CSc., Mrázek, Z., Gricová, M.
  • Publikace: Diagnostika 95. Plzeň: Západočeská universita, 1995. pp. 257-260.
  • Rok: 1995

Systematic Approach to Analysis of Electric Insulating Varnish

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: 11. medzinárodné symposium o dielektrických a izolačních systémoch v elektrotechnice. Bratislava: Dom techniky, 1995, pp. 93-96. ISBN 80-233-0352-X.
  • Rok: 1995

Využití metody scratch pro měření adherse laků

  • Autoři: Schorníková, M., doc. Ing. Pavel Mach, CSc., Mrázek, Z.
  • Publikace: Diagnostika 95. Plzeň: Západočeská universita, 1995. pp. 300-303.
  • Rok: 1995

Diagnostics of HTS Film Contacts

Low Resistance Contacts on Y-BA-CU-O-Films

  • Autoři: Ryšánek, V., doc. Ing. Pavel Mach, CSc.,
  • Publikace: CTU Seminar 94. Praha: České vysoké učení technické v Praze, 1994, pp. 141-142.
  • Rok: 1994

Nonlinearity and Noise of Thick Film Resistor

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Symposium Elektronic-Technologie 94. 17th International Spring Seminar on Electrotechnology. Dresden: TU Dresden, 1994, pp. 197-204.
  • Rok: 1994

Některé statistické nástroje řízení jakosti výroby

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: SEJAK 01. Výchova k jakosti. Plzeň: Západočeská universita, 1993. pp. 21-28.
  • Rok: 1993

Some Problems of Education in Electronic Technology

  • Autoři: doc. Ing. Pavel Mach, CSc.,
  • Publikace: Transaction of the University of Kosice. Vol 2, No. 1. Cambridge: Riecansky Science, 1993, pp. 76-78.
  • Rok: 1993

The Tunnelling Junction - a Humidity Sensor of the Near Future?

  • Autoři: doc. Ing. Pavel Mach, CSc., Klabačka, E.
  • Publikace: 16th ISSE - Thick and Thin Film Sensors. Szklarska Poreba: Institute of Electron Technology, 1993, pp. 32.
  • Rok: 1993

Thermal Oxidation of Silicon Using 1,2 - Dichlorethan

Za stránku zodpovídá: Ing. Mgr. Radovan Suk